Koupit 2430-5 s BYCHPS
Koupit se zárukou
2430-5
- Part Number:
- 2430-5
- Výrobce:
- Bussmann (Eaton)
- Popis:
- BUSS FUSEBLOCK
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14798 Pieces
- Datový list:
- 2430-5.pdf
Úvod
BYCHIPS je distribuční odrůda pro 2430-5, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 2430-5 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 11 Weeks |
| Výrobní číslo výrobce: | 2430-5 |
| Rozšířený popis: | Fuse Circuit |
| Popis: | BUSS FUSEBLOCK |
| Email: | [email protected] |
Související díly pro 2430-5
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
2430-12 | Eaton | BUSS FUSEBLOCK | Dotaz |
|
2430-7 | Eaton | BUSS FUSEBLOCK | Dotaz |
 |
L60030C2C | Littelfuse Inc. | FUSE BLOCK CART 600V 30A CHASSIS | Dotaz |
|
HPF-RR | Eaton | FUSE HLDR CART 600V 20A PNL MNT | Dotaz |
|
2430-4 | Eaton | BUSS FUSEBLOCK | Dotaz |
|
2430-6 | Eaton | BUSS FUSEBLOCK | Dotaz |
 |
BK-6012 | MPD (Memory Protection Devices) | FUSE CLIP BLADE PCB | Dotaz |
|
2430-1 | Eaton | BUSS FUSEBLOCK | Dotaz |
 |
03560005Z | Littelfuse Inc. | FUSE BLOCK CART 250V 15A CHASSIS | Dotaz |
|
0AFH0020Z | Littelfuse Inc. | FUSE HOLDER BLADE 30A PANEL MNT | Dotaz |
|
2430-8 | Eaton | BUSS FUSEBLOCK | Dotaz |
|
BK/1A1119-05-R | Eaton | FUSE CLIP CARTRIDGE PCB | Dotaz |
|
T60030-1SR | Eaton | FUSE BLOCK CART 600V 30A CHASSIS | Dotaz |
|
2430-2 | Eaton | BUSS FUSEBLOCK | Dotaz |
 |
03450101HX010 | Littelfuse Inc. | FUSE HLDR CARTRIDGE 250V 16A PCB | Dotaz |
|
2430-9 | Eaton | BUSS FUSEBLOCK | Dotaz |
 |
01530030Z | Littelfuse Inc. | FUSE HOLDER BLADE 32V IN LINE | Dotaz |
|
2430-10 | Eaton | BUSS FUSEBLOCK | Dotaz |
|
2430-3 | Eaton | BUSS FUSEBLOCK | Dotaz |
|
00940263Z | Littelfuse Inc. | FUSE HOLDER BLADE IN LINE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers