Koupit 200HXC680MEFCSN30X30 s BYCHPS
Koupit se zárukou
200HXC680MEFCSN30X30
- Part Number:
- 200HXC680MEFCSN30X30
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM 680UF 20% 200V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18837 Pieces
Úvod
BYCHIPS je distribuční odrůda pro 200HXC680MEFCSN30X30, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 200HXC680MEFCSN30X30 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 200V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 1.181" Dia (30.00mm) |
| Série: | HXC |
| Ripple Current: | 2.82A |
| Polarizace: | - |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Provozní teplota: | -25°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 200HXC680MEFCSN30X30 |
| Životnost @ Temp.: | 2000 Hrs @ 105°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 1.260" (32.00mm) |
| Rozšířený popis: | 680µF 200V Aluminum Capacitors Radial, Can - Snap-In 2000 Hrs @ 105°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 680UF 20% 200V SNAP |
| kapacitní: | 680µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro 200HXC680MEFCSN30X30
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
200HXC560MEFCSN22X45 | Rubycon | CAP ALUM 560UF 20% 200V SNAP | Dotaz |
|
200HXC680MEFCSN22X50 | Rubycon | CAP ALUM 680UF 20% 200V SNAP | Dotaz |
|
200HXC390MEFCSN25X25 | Rubycon | CAP ALUM 390UF 20% 200V SNAP | Dotaz |
|
200HXC390MEFCSN22X35 | Rubycon | CAP ALUM 390UF 20% 200V SNAP | Dotaz |
|
200HXC1000MEFCSN35X30 | Rubycon | CAP ALUM 1000UF 20% 200V SNAP | Dotaz |
|
200HXC680MEFCSN25X35 | Rubycon | CAP ALUM 680UF 20% 200V SNAP | Dotaz |
|
200HXC820MEFCSN35X25 | Rubycon | CAP ALUM 820UF 20% 200V SNAP | Dotaz |
|
200HXC330MEFCSN22X30 | Rubycon | CAP ALUM 330UF 20% 200V SNAP | Dotaz |
|
200HXC560MEFCSN30X25 | Rubycon | CAP ALUM 560UF 20% 200V SNAP | Dotaz |
|
200HXC470MEFCSN25X30 | Rubycon | CAP ALUM 470UF 20% 200V SNAP | Dotaz |
|
200HXC560MEFCSN25X35 | Rubycon | CAP ALUM 560UF 20% 200V SNAP | Dotaz |
 |
200HXC1200MEFC35X35 | Rubycon | CAP ALUM 1200UF 20% 200V SNAP | Dotaz |
|
200HXC470MEFCSN22X40 | Rubycon | CAP ALUM 470UF 20% 200V SNAP | Dotaz |
|
200HXC1800MEFCSN35X45 | Rubycon | CAP ALUM 1800UF 20% 200V SNAP | Dotaz |
|
200HXC560MEFC30X25 | Rubycon | CAP ALUM 560UF 20% 200V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers