Koupit 170M5452 s BYCHPS
Koupit se zárukou
170M5452
- Part Number:
- 170M5452
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 1400A 550V US 2GKN/50 AR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19478 Pieces
- Datový list:
- 170M5452.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M5452, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M5452 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | 170M5452 |
| Typ pojistky: | Square |
| Popis: | FUSE 1400A 550V US 2GKN/50 AR |
| Email: | [email protected] |
Související díly pro 170M5452
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M5459 | Eaton | FUSE SQUARE 450A 700VAC | Dotaz |
|
170M5442 | Eaton | FUSE SQUARE 400A 1.3KVAC | Dotaz |
|
170M5463 | Eaton | FUSE SQUARE 700A 700VAC | Dotaz |
|
170M5467 | Eaton | FUSE SQUARE 1.1KA 700VAC | Dotaz |
|
170M5410 | Eaton | FUSE SQUARE 500A 700VAC | Dotaz |
|
170M5413 | Eaton | FUSE SQUARE 700A 700VAC | Dotaz |
|
170M5499 | Eaton | FUSE SQUARE 900A 1.3KVAC | Dotaz |
|
170M5415 | Eaton | FUSE SQUARE 900A 700VAC | Dotaz |
|
170M5440 | Eaton | FUSE SQUARE 315A 1.3KVAC | Dotaz |
|
170M5447 | Eaton | FUSE SQUARE 700A 1.3KVAC | Dotaz |
|
170M5448 | Eaton | FUSE SQUARE 800A 1.3KVAC | Dotaz |
|
170M5408 | Eaton | FUSE SQUARE 400A 700VAC | Dotaz |
|
170M5460 | Eaton | FUSE SQUARE 500A 700VAC | Dotaz |
|
170M5458 | Eaton | FUSE SQUARE 400A 700VAC | Dotaz |
|
170M5417 | Eaton | FUSE SQUARE 1.1KA 700VAC | Dotaz |
 |
170M5464-G | Eaton | FUSE 800A 690V 2BKN/50 AR UC | Dotaz |
|
170M5466 | Eaton | FUSE SQUARE 1KA 700VAC | Dotaz |
|
170M5474 | Eaton | FUSE 1600A 500V 2BKN/50 AR UC | Dotaz |
|
170M5418 | Eaton | FUSE SQUARE 1.25KA 700VAC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers