Koupit 170M0209 s BYCHPS
Koupit se zárukou
170M0209
- Part Number:
- 170M0209
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 16A 660V 0000FU/65 GR UR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13223 Pieces
- Datový list:
- 170M0209.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M0209, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M0209 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | - |
|---|---|
| Série: | * |
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Typ montáže: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 170M0209 |
| Typ pojistky: | Square |
| Popis: | FUSE 16A 660V 0000FU/65 GR UR |
| Email: | [email protected] |
Související díly pro 170M0209
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M0216 | Eaton | FUSE 80A 660V 0000FU/65 AR UR | Dotaz |
|
170M0217 | Eaton | FUSE 100A 660V 0000FU/65 AR UR | Dotaz |
|
170M0213 | Eaton | FUSE 40A 660V 0000FU/65 GR UR | Dotaz |
|
170M0212 | Eaton | FUSE 32A 660V 0000FU/65 GR UR | Dotaz |
|
FRS-R-1-1/8 | Eaton | FUSE TRON DUAL ELEMENT FUSE CLAS | Dotaz |
 |
0CNN400E.V | Littelfuse Inc. | FUSE STRIP 400A 125VAC/80VDC | Dotaz |
|
170M0214 | Eaton | FUSE 50A 660V 0000FU/65 AR UR | Dotaz |
|
170M0161 | Eaton | FUSE 25A 660V 0000/80 GR UR | Dotaz |
|
170M0215 | Eaton | FUSE 63A 660V 0000FU/65 AR UR | Dotaz |
 |
FNM-25 | Eaton | FUSE CARTRIDGE 25A 250VAC 5AG | Dotaz |
|
1003R1C3.8 | Littelfuse Inc. | FUSE CRTRDGE 100A 3.8KVAC NONSTD | Dotaz |
|
170M0211 | Eaton | FUSE 25A 660V 0000FU/65 GR UR | Dotaz |
|
0CCK015.V | Littelfuse Inc. | FUSE CRTRDGE 15A 125VDC CYLINDR | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers