Koupit 11330-80RA s BYCHPS
Koupit se zárukou
11330-80RA
- Part Number:
- 11330-80RA
- Výrobce:
- Bussmann (Eaton)
- Popis:
- DISCONNECT BLOCK ASSY
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12606 Pieces
- Datový list:
- 11330-80RA.pdf
Úvod
BYCHIPS je distribuční odrůda pro 11330-80RA, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 11330-80RA e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | 11330-80RA |
| Popis: | DISCONNECT BLOCK ASSY |
| Email: | [email protected] |
Související díly pro 11330-80RA
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
11330-80A | Eaton | DISC. BLOCK ASSY | Dotaz |
 |
0032.1148 | Schurter Inc. | FEL/SIL CARRIER 5X20 IP 40 | Dotaz |
|
LPF1-24 | Eaton | FUSE PULLER LIGHTED 24V | Dotaz |
|
11330-83 | Eaton | DISC. BLOCK ASSY. | Dotaz |
 |
01520900U | Littelfuse Inc. | DUST COVER FOR MAXIHOLDER 152001 | Dotaz |
 |
912-200 | Littelfuse Inc. | FUSE SPRING 0.026 GALV WIRE | Dotaz |
|
BO3-02BF | Eaton | FUSEHOLDER CAP | Dotaz |
|
11330-82 | Eaton | DISC BLOCK ASSY | Dotaz |
|
2A1630-6 | Eaton | MAIN DEVICE SUB ASSY 200A | Dotaz |
|
CTPT5 | Littelfuse Inc. | HARDWARE ACC POLE INSULATION CAP | Dotaz |
|
11330-80 | Eaton | DISC. BLOCK ASS'Y | Dotaz |
|
11330-81 | Eaton | DISC. BLOCK ASS'Y | Dotaz |
|
11330-84 | Eaton | SHIELD SUB ASSEMBLY | Dotaz |
|
0D0Z18RDZ | Littelfuse Inc. | GAUGE RING FOR 10A D02 FUSE RED | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers