Koupit 1111J1K02P10HQT s BYCHPS
Koupit se zárukou
1111J1K02P10HQT
- Part Number:
- 1111J1K02P10HQT
- Výrobce:
- Knowles / Syfer
- Popis:
- CAP CER HIGH Q 1111
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17653 Pieces
- Datový list:
- 1111J1K02P10HQT.pdf
Úvod
BYCHIPS je distribuční odrůda pro 1111J1K02P10HQT, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 1111J1K02P10HQT e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 1111J1K02P10HQT |
| Rozšířený popis: | Ceramic Capacitor |
| Popis: | CAP CER HIGH Q 1111 |
| Email: | [email protected] |
Související díly pro 1111J1K02P10HQT
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
1111J1K02P00BQT | Knowles Syfer | CAP CER 2PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P10CQT | Knowles Syfer | CAP CER HIGH Q 1111 | Dotaz |
|
1111J1K02P10DQT | Knowles Syfer | CAP CER HIGH Q 1111 | Dotaz |
|
1111J1K02P20BQT | Knowles Syfer | CAP CER 2.2PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P70CQT | Knowles Syfer | CAP CER 2.7PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P20HQT | Knowles Syfer | CAP CER 2.2PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P40HQT | Knowles Syfer | CAP CER 2.4PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P40BQT | Knowles Syfer | CAP CER 2.4PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P40CQT | Knowles Syfer | CAP CER 2.4PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P00HQT | Knowles Syfer | CAP CER 2PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P70DQT | Knowles Syfer | CAP CER 2.7PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P10BQT | Knowles Syfer | CAP CER HIGH Q 1111 | Dotaz |
|
1111J1K02P40DQT | Knowles Syfer | CAP CER 2.4PF 1000V C0G/NP0 1111 | Dotaz |
|
1111J1K02P70BQT | Knowles Syfer | CAP CER 2.7PF 1000V C0G/NP0 1111 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers