Koupit PAS311HR-VA6R s BYCHPS
Koupit se zárukou
PAS311HR-VA6R
- Part Number:
- PAS311HR-VA6R
- Výrobce:
- Taiyo Yuden
- Popis:
- CAP 30MF 3.3V SURFACE MOUNT
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16443 Pieces
- Datový list:
- 1.PAS311HR-VA6R.pdf2.PAS311HR-VA6R.pdf
Úvod
BYCHIPS je distribuční odrůda pro PAS311HR-VA6R, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PAS311HR-VA6R e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 3.3V |
|---|---|
| Tolerance: | - |
| Ukončení: | Surface Mount |
| Velikost / Rozměry: | 0.150" Dia (3.80mm) |
| Série: | HR |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Coin, Wide Terminals - Opposite Sides |
| Ostatní jména: | 587-2155-2 |
| Provozní teplota: | -20°C ~ 60°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | PAS311HR-VA6R |
| Životnost @ Temp.: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | 0.057" (1.45mm) |
| Rozšířený popis: | 30mF (EDLC) Supercapacitor 3.3V Coin, Wide Terminals - Opposite Sides 120 Ohm |
| ESR (Equivalent Resistance Series): | 120 Ohm |
| Popis: | CAP 30MF 3.3V SURFACE MOUNT |
| kapacitní: | 30mF |
| Email: | [email protected] |
Související díly pro PAS311HR-VA6R
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
BZ12GA124ZAB | AVX Corporation | CAP 120MF -20% +80% 16V T/H | Dotaz |
 |
PAS311HR-VG1 | Taiyo Yuden | CAP 30MF 3.3V SURFACE MOUNT | Dotaz |
 |
PAS311SR-VA6R | Taiyo Yuden | CAP 30MF 2.6V SURFACE MOUNT | Dotaz |
 |
KSL-3R3703S-R | Eaton | CAP 70MF -20% +80% 3.3V SMD | Dotaz |
 |
JJC0E157MELC | Nichicon | CAP 150F 20% 2.5V THROUGH HOLE | Dotaz |
 |
B49410B2366Q000 | EPCOS (TDK) | CAP 3600F -10% +30% 2.5V CHAS MT | Dotaz |
 |
FG0H105ZF | KEMET | CAP 1F -20% +80% 5.5V T/H | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers