Koupit DRV632PW s BYCHPS
Koupit se zárukou
DRV632PW
- Part Number:
- DRV632PW
- Výrobce:
- Popis:
- IC LINE DVR STER ADJ 14TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19287 Pieces
- Datový list:
- DRV632PW.pdf
Úvod
BYCHIPS je distribuční odrůda pro DRV632PW, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu DRV632PW e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 3 V ~ 3.6 V |
|---|---|
| Dodavatel zařízení Package: | 14-TSSOP |
| Specifikace: | Single-Ended Output |
| Série: | DirectPath™ |
| Obal: | Tube |
| Paket / krabice: | 14-TSSOP (0.173", 4.40mm Width) |
| Ostatní jména: | 296-33273-5 DRV632PW-ND |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Počet kanálů: | 2 |
| Úroveň citlivosti na vlhkost (MSL): | 2 (1 Year) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | DRV632PW |
| Rozhraní: | Analog |
| Funkce: | Line Driver |
| Rozšířený popis: | Audio Line Driver 2 Channel 14-TSSOP |
| Popis: | IC LINE DVR STER ADJ 14TSSOP |
| Aplikace: | Pre-Amplifier, Consumer Audio |
| Email: | [email protected] |
Související díly pro DRV632PW
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
|
TPA5051RSAT | Texas Instruments | IC DGTL AUDIO DELAY 4CH 16-VQFN | Dotaz |
|
TDA7401013TR | STMicroelectronics | IC PROCESSOR AUDIO DGTL 28SOIC | Dotaz |
|
TAS5508APAGRG4 | Texas Instruments | IC AUDIO PWM PROC 64TQFP | Dotaz |
 |
STA559BWSTR | STMicroelectronics | IC DAS 2.1 CHANNEL POWERSSO36 | Dotaz |
|
DRV632PWR | Texas Instruments | IC LINE DVR STER ADJ 14TSSOP | Dotaz |
 |
LC89075WA-H | ON Semiconductor | IC AUDIO I/F RECEIVER ADC 64SQFP | Dotaz |
 |
LC823450XATBG | ON Semiconductor | IC AUDIO PROCESSOR LSI 154WLCSP | Dotaz |
 |
TEF6892H/V3,557 | NXP USA Inc. | IC RADIO SIGNAL PROC 44-QFP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers