Koupit ZMS2811TC s BYCHPS
Koupit se zárukou
ZMS2811TC
- Part Number:
- ZMS2811TC
- Výrobce:
- Diodes Incorporated
- Popis:
- DIODE SCHOTTKY 15V 0.02A SOD323
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17425 Pieces
- Datový list:
- ZMS2811TC.pdf
Úvod
BYCHIPS je distribuční odrůda pro ZMS2811TC, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ZMS2811TC e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Peak Reverse (Max): | 15V |
|---|---|
| Dodavatel zařízení Package: | SOD-323 |
| Série: | - |
| Odpor při IF, F: | - |
| Ztráta energie (Max): | 250mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | SC-76, SOD-323 |
| Provozní teplota: | -55°C ~ 150°C (TJ) |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | ZMS2811TC |
| Rozšířený popis: | RF Diode Schottky - Single 15V 20mA 250mW SOD-323 |
| Diode Type: | Schottky - Single |
| Popis: | DIODE SCHOTTKY 15V 0.02A SOD323 |
| Proud - Max: | 20mA |
| Kapacitní @ Vr, F: | 1.2pF @ 0V, 1MHz |
| Email: | [email protected] |
Související díly pro ZMS2811TC
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
UPP1002E3/TR7 | Microsemi Corporation | DIODE PIN 100V 2.5W POWERMITE | Dotaz |
 |
ZMS2800TC | Diodes Incorporated | DIODE SCHOTTKY 70V 15MA SOD323 | Dotaz |
 |
BA792,115 | NXP USA Inc. | DIODE BAND-SWITCHING SOD110 | Dotaz |
 |
HSMS-2829-TR1G | Broadcom Limited | DIODE SCHOTTKY RF QD 15V SOT-143 | Dotaz |
 |
HBAT-540C-TR1 | Broadcom Limited | DIODE SCHOTTKY 30V 430MA SOT-323 | Dotaz |
 |
BAT 62-02W E6327 | Infineon Technologies | DIODE SCHOTTKY 40V 20MA SCD-80 | Dotaz |
 |
1SS381,L3F | Toshiba Semiconductor and Storage | DIODE RF SWITCH 30V 100MA ESC | Dotaz |
|
ZMS2800TA | Diodes Incorporated | DIODE SCHOTTKY 70V 15MA SOD-323 | Dotaz |
|
HSMP-389V-BLKG | Broadcom Limited | DIODE PIN SWITCH 100V SOT-363 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers