Koupit W29GL064CB7S s BYCHPS
Koupit se zárukou
W29GL064CB7S
- Part Number:
- W29GL064CB7S
- Výrobce:
- Winbond Electronics Corporation
- Popis:
- IC FLASH 64MBIT 70NS 48TSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12874 Pieces
- Datový list:
- W29GL064CB7S.pdf
Úvod
BYCHIPS je distribuční odrůda pro W29GL064CB7S, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu W29GL064CB7S e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Dodavatel zařízení Package: | 48-TSOP |
| Rychlost: | 70ns |
| Série: | - |
| Obal: | Tube |
| Paket / krabice: | 48-TFSOP (0.724", 18.40mm Width) |
| Provozní teplota: | -40°C ~ 85°C (TA) |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Typ paměti: | Non-Volatile |
| Velikost paměti: | 64Mb (8M x 8, 4M x 16) |
| Formát paměti: | FLASH |
| Výrobní standardní doba výroby: | 14 Weeks |
| Výrobní číslo výrobce: | W29GL064CB7S |
| Rozhraní: | Parallel |
| Popis: | IC FLASH 64MBIT 70NS 48TSOP |
| Email: | [email protected] |
Související díly pro W29GL064CB7S
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
W29GL032CH7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Dotaz |
 |
W29GL064CH7T | Winbond Electronics | IC FLASH 64MBIT 70NS 56TSOP | Dotaz |
|
W29GL064CT7B | Winbond Electronics | IC FLASH 64MBIT 70NS 64LFBGA | Dotaz |
|
W29GL064CH7B | Winbond Electronics | IC FLASH 64MBIT 70NS 64LFBGA | Dotaz |
 |
W29GL064CT7S | Winbond Electronics | IC FLASH 64MBIT 70NS 48TSOP | Dotaz |
|
W29GL064CB7B | Winbond Electronics | IC FLASH 64MBIT 70NS 64LFBGA | Dotaz |
|
W29GL064CL7B | Winbond Electronics | IC FLASH 64MBIT 70NS 64LFBGA | Dotaz |
|
W29GL064CL7T | Winbond Electronics | IC FLASH 64MBIT 70NS 56TSOP | Dotaz |
|
W29GL032CB7S | Winbond Electronics | IC FLASH 32MBIT 70NS 48TSOP | Dotaz |
|
W29GL032CT7B | Winbond Electronics | IC FLASH 32MBIT 70NS 64LFBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers