Koupit VKI75-06P1 s BYCHPS
Koupit se zárukou
VKI75-06P1
- Part Number:
- VKI75-06P1
- Výrobce:
- IXYS Corporation
- Popis:
- MOD IGBT H-BRIDGE 600V ECO-PAC2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16917 Pieces
- Datový list:
- VKI75-06P1.pdf
Úvod
BYCHIPS je distribuční odrůda pro VKI75-06P1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu VKI75-06P1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 600V |
|---|---|
| VCE (o) (Max) @ VGE, Ic: | 2.8V @ 15V, 75A |
| Dodavatel zařízení Package: | ECO-PAC2 |
| Série: | - |
| Power - Max: | 208W |
| Paket / krabice: | ECO-PAC2 |
| Provozní teplota: | -40°C ~ 150°C (TJ) |
| NTC termistor: | Yes |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | VKI75-06P1 |
| Vstupní kapacita (Cies) @ Vce: | 2.8nF @ 25V |
| Vstup: | Standard |
| Typ IGBT: | NPT |
| Rozšířený popis: | IGBT Module NPT Full Bridge Inverter 600V 69A 208W Chassis Mount ECO-PAC2 |
| Popis: | MOD IGBT H-BRIDGE 600V ECO-PAC2 |
| Aktuální - sběratel Cutoff (Max): | 800µA |
| Proud - Collector (Ic) (Max): | 69A |
| Konfigurace: | Full Bridge Inverter |
| Email: | [email protected] |
Související díly pro VKI75-06P1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CM100TU-24F | Powerex Inc. | IGBT MOD 6PAC 1200V 100A F SER | Dotaz |
 |
APTGT150H60TG | Microsemi Corporation | IGBT MOD TRENCH FULL BRIDGE SP4 | Dotaz |
 |
FMS7G15US60S | Fairchild/ON Semiconductor | IGBT 600V 15A 25PM-AA | Dotaz |
 |
IXYN100N65C3H1 | IXYS | IGBT XPT 650V 166A SOT-227B | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers