Koupit UMJ325AB7225MMHP s BYCHPS
Koupit se zárukou
UMJ325AB7225MMHP
- Part Number:
- UMJ325AB7225MMHP
- Výrobce:
- Taiyo Yuden
- Popis:
- CAP CER 2.2UF 50V X7R 1210
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18581 Pieces
Úvod
BYCHIPS je distribuční odrůda pro UMJ325AB7225MMHP, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu UMJ325AB7225MMHP e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 50V |
|---|---|
| Tolerance: | ±20% |
| Tloušťka (Max): | 0.110" (2.80mm) |
| teplotní koeficient: | X7R |
| Velikost / Rozměry: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Série: | M |
| hodnocení: | AEC-Q200 |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 1210 (3225 Metric) |
| Provozní teplota: | -55°C ~ 125°C |
| Typ montáže: | Surface Mount, MLCC |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | UMJ325AB7225MMHP |
| Lead Style: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | Soft Termination |
| Poruchovost: | - |
| Rozšířený popis: | 2.2µF ±20% 50V Ceramic Capacitor X7R 1210 (3225 Metric) |
| Popis: | CAP CER 2.2UF 50V X7R 1210 |
| kapacitní: | 2.2µF |
| Aplikace: | Automotive, Boardflex Sensitive |
| Email: | [email protected] |
Související díly pro UMJ325AB7225MMHP
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
UMJ325AB7225KMHT | Taiyo Yuden | CAP CER 2.2UF 50V X7R 1210 | Dotaz |
|
UMJ325AB7225KMHP | Taiyo Yuden | CAP CER 2.2UF 50V X7R 1210 | Dotaz |
 |
UMJ325KB7106MMHP | Taiyo Yuden | CAP CER 10UF 50V X7R 1210 | Dotaz |
|
UMJ325AB7475MMHP | Taiyo Yuden | CAP CER 4.7UF 50V X7R 1210 | Dotaz |
|
UMJ325KB7106KMHT | Taiyo Yuden | CAP CER 10UF 50V X7R 1210 | Dotaz |
|
UMJ325AB7475KMHT | Taiyo Yuden | CAP CER 4.7UF 50V X7R 1210 | Dotaz |
|
UMJ325AB7475KMHP | Taiyo Yuden | CAP CER 4.7UF 50V X7R 1210 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers