Koupit TISP8200MDR-S s BYCHPS
Koupit se zárukou
TISP8200MDR-S
- Part Number:
- TISP8200MDR-S
- Výrobce:
- Bourns, Inc.
- Popis:
- THYRISTOR 120V 45A 8SOIC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 12624 Pieces
- Datový list:
- TISP8200MDR-S.pdf
Úvod
BYCHIPS je distribuční odrůda pro TISP8200MDR-S, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu TISP8200MDR-S e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Off State: | 120V |
|---|---|
| Napětí - Spínací: | 95V |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 8-SOIC (0.154", 3.90mm Width) |
| Ostatní jména: | TISP8200MDR-S-ND TISP8200MDR-STR TISP8200MDRS |
| Počet elementů: | 2 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 14 Weeks |
| Výrobní číslo výrobce: | TISP8200MDR-S |
| Popis: | THYRISTOR 120V 45A 8SOIC |
| Proud - špičkový impuls (8 / 20μs): | - |
| Proud - špičkový impuls (10 / 1000μs): | 45A |
| Proud - přidržení (H): | 150mA |
| kapacitní: | 35pF |
| Email: | [email protected] |
Související díly pro TISP8200MDR-S
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
TISP8201MDR-S | Bourns Inc. | THYRISTOR 120V 45A 8SOIC | Dotaz |
 |
TISP8210MDR-S | Bourns Inc. | SURGE PROT THYRIST NEG V SLIC | Dotaz |
|
TISP8200HDMR-S | Bourns Inc. | SLIC PROTECTOR 100 AMP | Dotaz |
 |
TISP8250DR-S | Bourns Inc. | THYRISTOR 250V 30A | Dotaz |
|
TISP4260H3LMR-S | Bourns Inc. | SINGLE BIDIRECTIONAL PROTECTOR | Dotaz |
 |
P2353ABL61 | Littelfuse Inc. | SIDAC SYM 3CHP 200V 250A TO220 | Dotaz |
 |
TISP8211MDR-S | Bourns Inc. | SURGE PROT THYRIST POS V SLIC | Dotaz |
|
TISP8201HDMR-S | Bourns Inc. | SLIC PROTECTOR 100 AMP | Dotaz |
|
TISP83121DR-S | Bourns Inc. | PROTECTOR OVER VOLTAGE 100V | Dotaz |
 |
P3602CARP | Littelfuse Inc. | SIDACTOR BI 340V 150A DO214 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers