Koupit T9AV1D12-22-01 s BYCHPS
Koupit se zárukou
T9AV1D12-22-01
- Part Number:
- T9AV1D12-22-01
- Popis:
- RELAY GEN PURP
- Stav volného vedení / RoHS:
- Obsahuje olovo a RoHS
- dostupné množství:
- 15259 Pieces
- Datový list:
- T9AV1D12-22-01.pdf
Úvod
BYCHIPS je distribuční odrůda pro T9AV1D12-22-01, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu T9AV1D12-22-01 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | 4-1423091-1 T9AV1D122201 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 19 Weeks |
| Výrobní číslo výrobce: | T9AV1D12-22-01 |
| Rozšířený popis: | Relay Coil |
| Popis: | RELAY GEN PURP |
| Email: | [email protected] |
Související díly pro T9AV1D12-22-01
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
T9AV1D22-48 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Dotaz |
 |
T9AV1D12-9 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 9V | Dotaz |
|
T9AV1D22-22 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Dotaz |
|
T9AV1D12-22 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 22V | Dotaz |
|
T9AV1D12-18 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 18V | Dotaz |
 |
T9AV1L22-24 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 24V | Dotaz |
|
T9AV1D12-22U | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Dotaz |
|
T9AV1H22-24 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURP | Dotaz |
|
T9AV1D12-12 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 12V | Dotaz |
|
T9AV1D22-18 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 18V | Dotaz |
|
T9AV1L22-12 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 30A 12V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers