Koupit STA32813TR s BYCHPS
Koupit se zárukou
STA32813TR
- Part Number:
- STA32813TR
- Výrobce:
- ST
- Popis:
- IC DAS 2.1CH HI EFF POWERSO36
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17092 Pieces
- Datový list:
- STA32813TR.pdf
Úvod
BYCHIPS je distribuční odrůda pro STA32813TR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu STA32813TR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 10 V ~ 36 V |
|---|---|
| Dodavatel zařízení Package: | PowerSO-36 |
| Specifikace: | Direct Digital Amplification |
| Série: | DDX™ |
| Obal: | Original-Reel® |
| Paket / krabice: | 36-BSSOP (0.433", 11.00mm Width) Exposed Pad |
| Ostatní jména: | 497-8876-6 |
| Provozní teplota: | -40°C ~ 125°C (TJ) |
| Počet kanálů: | 2 |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | STA32813TR |
| Rozhraní: | I²C, I²S |
| Funkce: | Fully Integrated Processor |
| Rozšířený popis: | Audio Fully Integrated Processor 2 Channel PowerSO-36 |
| Popis: | IC DAS 2.1CH HI EFF POWERSO36 |
| Aplikace: | Pre-Amplifier |
| Email: | [email protected] |
Související díly pro STA32813TR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
STA321TR | STMicroelectronics | IC AUDIO SYSTEM DGTL 4CH 64-LQFP | Dotaz |
 |
STA32613TR | STMicroelectronics | IC AUDIO SYSTEM 2.1 36POWERSOIC | Dotaz |
 |
STA32013TR | STMicroelectronics | IC AUD PROCESSOR 2.1MULTI 28SOIC | Dotaz |
|
STA323W13TR | STMicroelectronics | IC AUDIO SYSTEM DGTL 36POWERSOIC | Dotaz |
|
STA321MPLTR | STMicroelectronics | IC AUDIO PROCESSOR 8CHAN TQFP64 | Dotaz |
 |
STA559BW13TR | STMicroelectronics | IC DAS 2.1 CHANNEL POWERSSO36 | Dotaz |
|
STA321MPL1TR | STMicroelectronics | IC AUDIO PROCESSOR 8CHAN 64TQFP | Dotaz |
|
STA321MPL | STMicroelectronics | IC AUDIO PROCESSOR 8CHAN TQFP64 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers