Koupit SSTUB32S868DHLFT s BYCHPS
Koupit se zárukou
SSTUB32S868DHLFT
- Part Number:
- SSTUB32S868DHLFT
- Popis:
- IC REGIST BUFF 25BIT DDR2 176BGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18263 Pieces
- Datový list:
- SSTUB32S868DHLFT.pdf
Úvod
BYCHIPS je distribuční odrůda pro SSTUB32S868DHLFT, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SSTUB32S868DHLFT e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napájení: | 1.7 V ~ 1.9 V |
|---|---|
| Dodavatel zařízení Package: | 176-CABGA (6x15) |
| Série: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 176-TFBGA |
| Provozní teplota: | - |
| Počet bitů: | 25 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | SSTUB32S868DHLFT |
| Typ logiky: | Registered Buffer for DDR2 |
| Rozšířený popis: | Registered Buffer for DDR2 IC 176-CABGA (6x15) |
| Popis: | IC REGIST BUFF 25BIT DDR2 176BGA |
| Email: | [email protected] |
Související díly pro SSTUB32S868DHLFT
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SSTUB32866CHLFT | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 96-BGA | Dotaz |
|
SSTUB32S868CHLF | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 176BGA | Dotaz |
|
SSTUB32S868CHLFT | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 176BGA | Dotaz |
|
SSTUB32S868DHLF | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 176BGA | Dotaz |
|
SSTUB32S868BHLF | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 176BGA | Dotaz |
|
SSTUB32S868BHLFT | IDT, Integrated Device Technology Inc | IC REGIST BUFF 25BIT DDR2 176BGA | Dotaz |
|
SSTUB32S869BHLF | IDT, Integrated Device Technology Inc | IC REDRIVER 14BIT DDR2 150CABGA | Dotaz |
|
SSTUB32S869BHLFT | IDT, Integrated Device Technology Inc | IC REDRIVER 14BIT DDR2 150CABGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers