Koupit SK551E685ZARTR1 s BYCHPS
Koupit se zárukou
SK551E685ZARTR1
- Part Number:
- SK551E685ZARTR1
- Výrobce:
- AVX Corporation
- Popis:
- CAPACITOR
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 15508 Pieces
- Datový list:
- SK551E685ZARTR1.pdf
Úvod
BYCHIPS je distribuční odrůda pro SK551E685ZARTR1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu SK551E685ZARTR1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | - |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | SK551E685ZARTR1 |
| Rozšířený popis: | Ceramic Capacitor |
| Popis: | CAPACITOR |
| Email: | [email protected] |
Související díly pro SK551E685ZARTR1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
VJ1808A220JBLAT4X | Vishay Vitramon | CAP CER 22PF 630V NP0 1808 | Dotaz |
 |
SK551E685ZAR | AVX Corporation | CAP CER 6.8UF 100V Z5U RADIAL | Dotaz |
 |
SK551E685ZAA | AVX Corporation | CAPACITOR | Dotaz |
|
SK551E685ZAATR1 | AVX Corporation | CAPACITOR | Dotaz |
 |
2220Y0160683GCR | Knowles Syfer | CAP CER 2220 | Dotaz |
 |
1206J0500472KCT | Knowles Syfer | CAP CER 1206 | Dotaz |
|
0603J2500680GFR | Knowles Syfer | CAP CER 68PF 250V C0G/NP0 0603 | Dotaz |
 |
C316C360G3G5TA | KEMET | CAP CER 36PF 25V C0G RADIAL | Dotaz |
|
1206Y1001P80DAR | Knowles Syfer | CAP CER 1206 | Dotaz |
 |
12101A681JAT2A | AVX Corporation | CAP CER 680PF 100V C0G/NP0 1210 | Dotaz |
|
1206J1K00150JFT | Knowles Syfer | CAP CER 15PF 1KV C0G/NP0 1206 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers