Koupit RT334018 s BYCHPS
Koupit se zárukou
RT334018
- Part Number:
- RT334018
- Popis:
- RELAY GEN PURP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17599 Pieces
- Datový list:
- RT334018.pdf
Úvod
BYCHIPS je distribuční odrůda pro RT334018, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu RT334018 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | 4-1393240-7 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 19 Weeks |
| Výrobní číslo výrobce: | RT334018 |
| Rozšířený popis: | Relay Coil |
| Popis: | RELAY GEN PURP |
| Email: | [email protected] |
Související díly pro RT334018
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
RT334005 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 5V | Dotaz |
|
RT334060 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 60V | Dotaz |
|
RT334048 | TE Connectivity Potter & Brumfield Relays | RT334048 | Dotaz |
 |
RT334012F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 12V | Dotaz |
|
RT334005F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 5V | Dotaz |
 |
RT334012 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 12V | Dotaz |
|
RT334730 | TE Connectivity Potter & Brumfield Relays | RT334730 | Dotaz |
|
RT334024 | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 24V | Dotaz |
|
RT334006 | TE Connectivity Potter & Brumfield Relays | RT334006 | Dotaz |
 |
RT334024F | TE Connectivity Potter & Brumfield Relays | RELAY GEN PURPOSE SPST 16A 24V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers