Koupit PFS7325L s BYCHPS
Koupit se zárukou
PFS7325L
- Part Number:
- PFS7325L
- Výrobce:
- Power Integrations
- Popis:
- HIGH POWER PFC CONTROLLER
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18104 Pieces
- Datový list:
- PFS7325L.pdf
Úvod
BYCHIPS je distribuční odrůda pro PFS7325L, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu PFS7325L e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 10.2 V ~ 13.2 V |
|---|---|
| Dodavatel zařízení Package: | eSIP-16G |
| Série: | HiperPFS™ |
| Obal: | Tube |
| Paket / krabice: | 16-SIP, 13 Leads, Exposed Pad, Formed Leads |
| Provozní teplota: | -40°C ~ 125°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| režim: | Continuous Conduction (CCM) |
| Výrobní standardní doba výroby: | 12 Weeks |
| Výrobní číslo výrobce: | PFS7325L |
| Frekvence - Přepínání: | - |
| Rozšířený popis: | PFC IC Continuous Conduction (CCM) eSIP-16G |
| Popis: | HIGH POWER PFC CONTROLLER |
| Proud - Uvedení do provozu: | - |
| Email: | [email protected] |
Související díly pro PFS7325L
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
PFS7328H | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
|
PFS7327H | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
|
PFS7326H | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
|
PFS7323L | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
|
PFS7324L | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
 |
UC3854BDWTRG4 | Texas Instruments | IC PFC CTRLR AVERAGE CURR 16SOIC | Dotaz |
|
PFS7329H | Power Integrations | HIGH POWER PFC CONTROLLER | Dotaz |
|
UC2854DWG4 | Texas Instruments | IC PFC CTRLR AVERAGE CURR 16SOIC | Dotaz |
|
UCC2819N | Texas Instruments | IC PFC CTRLR AVERAGE CURR 16DIP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers