Koupit NT25L51-PR s BYCHPS
Koupit se zárukou
NT25L51-PR
- Part Number:
- NT25L51-PR
- Výrobce:
- Semtech
- Popis:
- IC AMP TIA AGC OC48/GPONG DIE
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18884 Pieces
- Datový list:
- NT25L51-PR.pdf
Úvod
BYCHIPS je distribuční odrůda pro NT25L51-PR, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu NT25L51-PR e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Transimpedance Amplifier |
|---|---|
| Dodavatel zařízení Package: | Die |
| Série: | - |
| Obal: | Bulk |
| Paket / krabice: | Die |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | NT25L51-PR |
| Rozšířený popis: | Transimpedance Amplifier IC Die |
| Popis: | IC AMP TIA AGC OC48/GPONG DIE |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro NT25L51-PR
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
NT25L59-GRP8 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Dotaz |
|
NT25L59-PR | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Dotaz |
|
NT25L51-WP | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Dotaz |
|
NT25L59-GRP6 | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Dotaz |
|
NT25L51-GRP8 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Dotaz |
|
NT25L55-PR | Semtech Corporation | IC AMP TIA BARE DIE | Dotaz |
|
NT25L59-WP | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Dotaz |
|
NT25L55-DTF8SR | Semtech Corporation | IC AMP TIA BARE DIE | Dotaz |
|
NT25L91-QFN-TR | Semtech Corporation | IC TXRX LDD&LA 2.5GBPS 28QFN | Dotaz |
|
NT25L51-GRP6 | Semtech Corporation | IC AMP TIA AGC OC48/GPONG DIE | Dotaz |
|
NT25L59-DTF8S | Semtech Corporation | IC AMP TIA 2.5G AGC GPON PD DIE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers