Koupit NCS37010DBG s BYCHPS
Koupit se zárukou
NCS37010DBG
- Part Number:
- NCS37010DBG
- Popis:
- IC GFCI CTLR CDM TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19148 Pieces
- Datový list:
- NCS37010DBG.pdf
Úvod
BYCHIPS je distribuční odrůda pro NCS37010DBG, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu NCS37010DBG e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 6 V ~ 12 V |
|---|---|
| Dodavatel zařízení Package: | 20-TSSOP |
| Série: | - |
| Obal: | Tube |
| Paket / krabice: | 20-TSSOP (0.173", 4.40mm Width) |
| Provozní teplota: | -40°C ~ 85°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | NCS37010DBG |
| Rozšířený popis: | Ground Fault Protection PMIC 20-TSSOP |
| Popis: | IC GFCI CTLR CDM TSSOP |
| Proud - Supply: | 2mA |
| Aplikace: | Ground Fault Protection |
| Email: | [email protected] |
Související díly pro NCS37010DBG
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
NCS37012DBRG | ON Semiconductor | IC GFCI CTLR CDM | Dotaz |
 |
NCS37010MNG | ON Semiconductor | GFCI STB BULK QFN | Dotaz |
 |
NCS37010MNTWG | ON Semiconductor | IC GFCI CTLR UL943 16QFN | Dotaz |
|
NCS37000DBG | ON Semiconductor | IC GFCI CTLR CDM TSSOP | Dotaz |
|
NCS37005MNG | ON Semiconductor | IC GFCI CTLR CDM 16QFN | Dotaz |
|
NCS37012MNTWG | ON Semiconductor | IC GFCI CTLR CDM | Dotaz |
|
NCS37010DBRG | ON Semiconductor | IC GFCI CTLR CDM TSSOP | Dotaz |
|
NCS37012DBG | ON Semiconductor | GFCI ST BULK TSSOP RECEPT | Dotaz |
|
NCS37005MNTWG | ON Semiconductor | IC GFCI CTLR CDM 16QFN | Dotaz |
|
NCS37000DBRG | ON Semiconductor | IC GFCI CTLR CDM TSSOP | Dotaz |
|
NCS37000MNTWG | ON Semiconductor | IC GFCI CTLR CDM 16QFN | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers