Koupit MT88L89ANR1 s BYCHPS
Koupit se zárukou
MT88L89ANR1
- Part Number:
- MT88L89ANR1
- Výrobce:
- Microsemi
- Popis:
- IC TXRX DTMF 3V 24SSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13345 Pieces
- Datový list:
- MT88L89ANR1.pdf
Úvod
BYCHIPS je distribuční odrůda pro MT88L89ANR1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MT88L89ANR1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.7 V ~ 3.6 V |
|---|---|
| Dodavatel zařízení Package: | 24-SSOP |
| Série: | - |
| Příkon (W): | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 24-SSOP (0.209", 5.30mm Width) |
| Provozní teplota: | -40°C ~ 85°C |
| Počet okruhů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | MT88L89ANR1 |
| Rozhraní: | - |
| Zahrnuje: | - |
| Funkce: | DTMF Transceiver |
| Rozšířený popis: | Telecom IC DTMF Transceiver 24-SSOP |
| Popis: | IC TXRX DTMF 3V 24SSOP |
| Proud - Supply: | 3.1mA |
| Email: | [email protected] |
Související díly pro MT88L89ANR1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MT88L89AS1 | Microsemi Corporation | IC TXRX DTMF 3V 20SOIC | Dotaz |
|
MT88L85AE1 | Microsemi Corporation | IC TXRX DTMF 3V 24DIP | Dotaz |
|
MT88L89ASR1 | Microsemi Corporation | IC TXRX DTMF 3V 20SOIC | Dotaz |
|
MT88L85AN1 | Microsemi Corporation | IC TXRX DTMF 3V 24SSOP | Dotaz |
|
MT88L85ANR1 | Microsemi Corporation | IC TXRX DTMF 3V 24SSOP | Dotaz |
|
MT88L70AN1 | Microsemi Corporation | IC RECEIVER DTMF 20SSOP | Dotaz |
|
MT88L89AN1 | Microsemi Corporation | IC TXRX DTMF 3V 24SSOP | Dotaz |
|
MT88L70AE1 | Microsemi Corporation | IC RECEIVER DTMF 18DIP | Dotaz |
|
MT88L70ANR1 | Microsemi Corporation | IC RECEIVER DTMF 20SSOP | Dotaz |
|
MT88L70AS1 | Microsemi Corporation | IC RECEIVER DTMF 18SOIC | Dotaz |
|
MT88L70ASR1 | Microsemi Corporation | IC RECEIVER DTMF 18SOIC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers