Koupit MITA30WB600TMH s BYCHPS
Koupit se zárukou
MITA30WB600TMH
- Part Number:
- MITA30WB600TMH
- Výrobce:
- IXYS Corporation
- Popis:
- IGBT MODULE CBI MINIPACK2
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18297 Pieces
- Datový list:
- MITA30WB600TMH.pdf
Úvod
BYCHIPS je distribuční odrůda pro MITA30WB600TMH, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MITA30WB600TMH e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 1600V |
|---|---|
| VCE (o) (Max) @ VGE, Ic: | - |
| Dodavatel zařízení Package: | MiniPack2 |
| Série: | - |
| Power - Max: | - |
| Paket / krabice: | MiniPack2 |
| Provozní teplota: | -40°C ~ 125°C (TJ) |
| NTC termistor: | No |
| Typ montáže: | Chassis Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | MITA30WB600TMH |
| Vstupní kapacita (Cies) @ Vce: | - |
| Vstup: | Standard |
| Typ IGBT: | NPT |
| Rozšířený popis: | IGBT Module NPT 1600V 40A Chassis Mount MiniPack2 |
| Popis: | IGBT MODULE CBI MINIPACK2 |
| Aktuální - sběratel Cutoff (Max): | - |
| Proud - Collector (Ic) (Max): | 40A |
| Konfigurace: | - |
| Email: | [email protected] |
Související díly pro MITA30WB600TMH
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
VS-GT100TP120N | Vishay Semiconductor Diodes Division | IGBT 1200V 180A 652W INT-A-PAK | Dotaz |
 |
MIXA100W1200TEH | IXYS | IGBT MODULE 1200V 108A HEX | Dotaz |
 |
MG06300D-BN4MM | Littelfuse Inc. | IGBT 600V 400A 940W PKG D | Dotaz |
|
VS-GT300YH120N | Vishay Semiconductor Diodes Division | IGBT 1200V 341A 1042W DIAP | Dotaz |
|
IXXN200N60B3 | IXYS | IGBT 600V 280A SOT-227 | Dotaz |
|
VS-GB300TH120U | Vishay Semiconductor Diodes Division | IGBT 1200V 530A 2119W INT-A-PAK | Dotaz |
|
MIXA81WB1200TEH | IXYS | IGBT MODULE 1200V 84A | Dotaz |
 |
CM75TU-12H | Powerex Inc. | IGBT MOD 6PAC 600V 75A U SER | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers