Koupit MAX78615+ATL/A02T s BYCHPS
Koupit se zárukou
MAX78615+ATL/A02T
- Part Number:
- MAX78615+ATL/A02T
- Výrobce:
- Maxim Integrated
- Popis:
- IC ENERGY MEASUREMENT TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14455 Pieces
- Datový list:
- MAX78615+ATL/A02T.pdf
Úvod
BYCHIPS je distribuční odrůda pro MAX78615+ATL/A02T, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu MAX78615+ATL/A02T e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | - |
|---|---|
| Napětí - I / O Low: | - |
| Napětí - I / O Vysoká: | - |
| Dodavatel zařízení Package: | - |
| Série: | - |
| Obal: | - |
| Paket / krabice: | - |
| Provozní teplota: | - |
| Typ montáže: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Chyba měření: | - |
| Výrobní číslo výrobce: | MAX78615+ATL/A02T |
| vstupní impedance: | - |
| Rozšířený popis: | Meter IC |
| Popis: | IC ENERGY MEASUREMENT TSSOP |
| Proud - Supply: | - |
| Email: | [email protected] |
Související díly pro MAX78615+ATL/A02T
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MAX78615+ATL/A02 | Maxim Integrated | IC ENERGY MEASUREMENT TSSOP | Dotaz |
 |
MAX78615+LMU/A01T | Maxim Integrated | IC ENERGY MEAS PROC LMU TQFN | Dotaz |
|
MAX78615+PSU/A00 | Maxim Integrated | IC ENERGY MEAS PROC LMU TQFN | Dotaz |
|
MAX78615+PPM/A03T | Maxim Integrated | IC ENERGY MEAS PROC 3PH TQFN | Dotaz |
|
MAX78615+PSU/A00T | Maxim Integrated | IC ENERGY MEAS PROC LMU TQFN | Dotaz |
|
MAX78615+PPM/C01T | Maxim Integrated | IC ENERGY MEAS PROC 3PH TQFN | Dotaz |
|
MAX78615+LMU/A01 | Maxim Integrated | IC ENERGY MEAS PROC LMU TQFN | Dotaz |
|
MAX78615+PPM/A03 | Maxim Integrated | IC ENERGY MEAS PROC 3PH TQFN | Dotaz |
|
MAX78615+PPM/C01 | Maxim Integrated | IC ENERGY MEAS PROC 3PH TQFN | Dotaz |
 |
MAX786CAI | Maxim Integrated | IC REG QD BCK/LINEAR SYNC 28SSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers