Koupit M02067G-12 s BYCHPS
Koupit se zárukou
M02067G-12
- Part Number:
- M02067G-12
- Popis:
- IC AMP OPTICAL POST MMIC PECL
- Stav volného vedení / RoHS:
- Obsahuje olověný / RoHS neodpovídající
- dostupné množství:
- 17506 Pieces
- Datový list:
- M02067G-12.pdf
Úvod
BYCHIPS je distribuční odrůda pro M02067G-12, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu M02067G-12 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 2.97 V ~ 3.63 V |
|---|---|
| Typ: | Laser Diode Driver |
| Dodavatel zařízení Package: | 24-QFN (4x4) |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 24-VFQFN Exposed Pad |
| Ostatní jména: | 1465-1439 |
| Provozní teplota: | -40°C ~ 85°C |
| Počet kanálů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | M02067G-12 |
| Rozšířený popis: | Laser Driver IC 2.1Gbps 1 Channel 2.97 V ~ 3.63 V 24-QFN (4x4) |
| Popis: | IC AMP OPTICAL POST MMIC PECL |
| Rychlost přenosu dat: | 2.1Gbps |
| Proud - Supply: | 52mA |
| Proud - Modulace: | 100mA |
| Proud - Bias: | 120mA |
| Email: | [email protected] |
Související díly pro M02067G-12
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
M02066G-82 | M/A-Com Technology Solutions | IC AMP OPTICAL POST MMIC PECL | Dotaz |
 |
M02061G-12 | M/A-Com Technology Solutions | IC AMP OPTICAL POST MMIC PECL | Dotaz |
 |
SY100EL1001ZC-TR | Microchip Technology | IC LASER DRIVER 1.25GBPS 16SOIC | Dotaz |
|
M02069G-12 | M/A-Com Technology Solutions | IC AMP OPTICAL POST MMIC PECL | Dotaz |
 |
MAX3600CTL+ | Maxim Integrated | IC LASER DVR PROJECTOR 40TQFN | Dotaz |
 |
AD9665ACPZ-REEL7 | Analog Devices Inc. | IC LASER DRVR 4CHAN 5.5V 32LFCSP | Dotaz |
 |
ADN2530YCPZ-R2 | Analog Devices Inc. | IC LASER DRIVER 11.3GBPS 16LFCSP | Dotaz |
|
M02061G-21 | M/A-Com Technology Solutions | IC AMP OPTICAL POST MMIC PECL | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers