Koupit LGY1E333MELC50 s BYCHPS
Koupit se zárukou
LGY1E333MELC50
- Part Number:
- LGY1E333MELC50
- Výrobce:
- Nichicon
- Popis:
- CAP ALUM 33000UF 20% 25V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16167 Pieces
- Datový list:
- 1.LGY1E333MELC50.pdf2.LGY1E333MELC50.pdf
Úvod
BYCHIPS je distribuční odrůda pro LGY1E333MELC50, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LGY1E333MELC50 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 25V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 1.378" Dia (35.00mm) |
| Série: | LGY |
| Ripple Current: | 4.2A @ 120Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Ostatní jména: | 493-8624 LGY1E333MELC50-ND |
| Provozní teplota: | -40°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 27 Weeks |
| Výrobní číslo výrobce: | LGY1E333MELC50 |
| Životnost @ Temp.: | 5000 Hrs @ 105°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 2.047" (52.00mm) |
| Rozšířený popis: | 33000µF 25V Aluminum Capacitors Radial, Can - Snap-In 5000 Hrs @ 105°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 33000UF 20% 25V SNAP |
| kapacitní: | 33000µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro LGY1E333MELC50
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LGY1E103MELB30 | Nichicon | CAP ALUM 10000UF 20% 25V SNAP | Dotaz |
 |
LGY1E223MELB45 | Nichicon | CAP ALUM 22000UF 20% 25V SNAP | Dotaz |
 |
LGY1E822MELZ35 | Nichicon | CAP ALUM 8200UF 20% 25V SNAP | Dotaz |
|
LGY1E123MELB30 | Nichicon | CAP ALUM 12000UF 20% 25V SNAP | Dotaz |
 |
LGY1E273MELC45 | Nichicon | CAP ALUM 27000UF 20% 25V SNAP | Dotaz |
 |
LGY1E183MELA50 | Nichicon | CAP ALUM 18000UF 20% 25V SNAP | Dotaz |
 |
LGY1E472MELZ25 | Nichicon | CAP ALUM 4700UF 20% 25V SNAP | Dotaz |
 |
LGY1E153MELB35 | Nichicon | CAP ALUM 15000UF 20% 25V SNAP | Dotaz |
 |
LGY1E103MELZ40 | Nichicon | CAP ALUM 10000UF 20% 25V SNAP | Dotaz |
 |
LGY1E562MELZ30 | Nichicon | CAP ALUM 5600UF 20% 25V SNAP | Dotaz |
 |
LGY1E123MELZ45 | Nichicon | CAP ALUM 12000UF 20% 25V SNAP | Dotaz |
 |
LGY1E822MELA30 | Nichicon | CAP ALUM 8200UF 20% 25V SNAP | Dotaz |
 |
LGY1E183MELB40 | Nichicon | CAP ALUM 18000UF 20% 25V SNAP | Dotaz |
 |
LGY1E822MELB25 | Nichicon | CAP ALUM 8200UF 20% 25V SNAP | Dotaz |
 |
LGY1E223MELC35 | Nichicon | CAP ALUM 22000UF 20% 25V SNAP | Dotaz |
 |
LGY1E153MELC30 | Nichicon | CAP ALUM 15000UF 20% 25V SNAP | Dotaz |
 |
LGY1E103MELA35 | Nichicon | CAP ALUM 10000UF 20% 25V SNAP | Dotaz |
 |
LGY1E123MELA40 | Nichicon | CAP ALUM 12000UF 20% 25V SNAP | Dotaz |
 |
LGY1E153MELA45 | Nichicon | CAP ALUM 15000UF 20% 25V SNAP | Dotaz |
|
LGY1E682MELZ30 | Nichicon | CAP ALUM 6800UF 20% 25V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers