Koupit LGU2F271MELA s BYCHPS
Koupit se zárukou
LGU2F271MELA
- Part Number:
- LGU2F271MELA
- Výrobce:
- Nichicon
- Popis:
- CAP ALUM 270UF 20% 315V SNAP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 18702 Pieces
- Datový list:
- 1.LGU2F271MELA.pdf2.LGU2F271MELA.pdf
Úvod
BYCHIPS je distribuční odrůda pro LGU2F271MELA, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LGU2F271MELA e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 315V |
|---|---|
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | - |
| Velikost / Rozměry: | 0.984" Dia (25.00mm) |
| Série: | LGU |
| Ripple Current: | 1.16A @ 120Hz |
| Polarizace: | Polar |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can - Snap-In |
| Ostatní jména: | 493-8496 LGU2F271MELA-ND |
| Provozní teplota: | -25°C ~ 105°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 25 Weeks |
| Výrobní číslo výrobce: | LGU2F271MELA |
| Životnost @ Temp.: | 3000 Hrs @ 105°C |
| Rozestup vývodù: | 0.394" (10.00mm) |
| Impedance: | - |
| Výška - Sedící (Max): | 1.457" (37.00mm) |
| Rozšířený popis: | 270µF 315V Aluminum Capacitors Radial, Can - Snap-In 3000 Hrs @ 105°C |
| ESR (Equivalent Resistance Series): | - |
| Popis: | CAP ALUM 270UF 20% 315V SNAP |
| kapacitní: | 270µF |
| Aplikace: | General Purpose |
| Email: | [email protected] |
Související díly pro LGU2F271MELA
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LGU2F271MELZ | Nichicon | CAP ALUM 270UF 20% 315V SNAP | Dotaz |
 |
LGU2F271MELB | Nichicon | CAP ALUM 270UF 20% 315V SNAP | Dotaz |
 |
LGU2F471MELA | Nichicon | CAP ALUM 470UF 20% 315V SNAP | Dotaz |
 |
LGU2F391MELC | Nichicon | CAP ALUM 390UF 20% 315V SNAP | Dotaz |
 |
LGU2F221MELY | Nichicon | CAP ALUM 220UF 20% 315V SNAP | Dotaz |
 |
LGU2F151MELY | Nichicon | CAP ALUM 150UF 20% 315V SNAP | Dotaz |
 |
LGU2F151MELA | Nichicon | CAP ALUM 150UF 20% 315V SNAP | Dotaz |
 |
LGU2F331MELB | Nichicon | CAP ALUM 330UF 20% 315V SNAP | Dotaz |
|
LGU2F471MELC | Nichicon | CAP ALUM 470UF 20% 315V SNAP | Dotaz |
|
LGU2F221MELB | Nichicon | CAP ALUM 220UF 20% 315V SNAP | Dotaz |
 |
LGU2F681MELB | Nichicon | CAP ALUM 680UF 20% 315V SNAP | Dotaz |
 |
LGU2F221MELA | Nichicon | CAP ALUM 220UF 20% 315V SNAP | Dotaz |
 |
LGU2F681MELC | Nichicon | CAP ALUM 680UF 20% 315V SNAP | Dotaz |
 |
LGU2F221MELZ | Nichicon | CAP ALUM 220UF 20% 315V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers