Koupit LE9662WQCT s BYCHPS
Koupit se zárukou
LE9662WQCT
- Part Number:
- LE9662WQCT
- Výrobce:
- Microsemi
- Popis:
- IC SLIC 2CH UNIV 100V 48QFN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13311 Pieces
- Datový list:
- LE9662WQCT.pdf
Úvod
BYCHIPS je distribuční odrůda pro LE9662WQCT, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LE9662WQCT e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 3.135 V ~ 3.465 V |
|---|---|
| Dodavatel zařízení Package: | 56-QFN (8x8) |
| Série: | miSLIC™ |
| Příkon (W): | - |
| Obal: | Cut Tape (CT) |
| Paket / krabice: | 56-VFQFN Exposed Pad |
| Provozní teplota: | -40°C ~ 85°C |
| Počet okruhů: | 2 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 26 Weeks |
| Výrobní číslo výrobce: | LE9662WQCT |
| Rozhraní: | 4-Wire |
| Zahrnuje: | - |
| Funkce: | Subscriber Line Interface Concept (SLIC) |
| Rozšířený popis: | Telecom IC Subscriber Line Interface Concept (SLIC) 56-QFN (8x8) |
| Popis: | IC SLIC 2CH UNIV 100V 48QFN |
| Proud - Supply: | 25mA |
| Email: | [email protected] |
Související díly pro LE9662WQCT
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LE9662WQC | Microsemi Corporation | IC SLIC 2CH UNIV 100V 48QFN | Dotaz |
|
LE9661WQC | Microsemi Corporation | IC SLIC 1CH UNIV 100V 48QFN | Dotaz |
 |
SI3210-FT | Silicon Labs | IC SLIC/CODEC PROGRAMMBL 38TSSOP | Dotaz |
 |
LM567CM/NOPB | Texas Instruments | IC TONE DECODR PHAS LOC LP 8SOIC | Dotaz |
 |
PEB 3342 HT V2.2 | Infineon Technologies | IC CODEC VOIP 100-TQFP | Dotaz |
 |
PBL38630/2QNT | Infineon Technologies | IC LINE INTERFACE SLIC PLCC-28 | Dotaz |
|
LE9661WQCT | Microsemi Corporation | IC SLIC 1CH UNIV 100V 48QFN | Dotaz |
|
LE79231DJCT | Microsemi Corporation | IC SLAC 1CH 70V MTRG 32PLCC | Dotaz |
|
LE79112ADGCT | Microsemi Corporation | IC VOICE LINE VCP 32CH 144LBGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers