Koupit LE8577LFJCT s BYCHPS
Koupit se zárukou
LE8577LFJCT
- Part Number:
- LE8577LFJCT
- Výrobce:
- Microsemi
- Popis:
- IC SLIC 2CH 58 DB LG BAL 44PLCC
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 19723 Pieces
- Datový list:
- LE8577LFJCT.pdf
Úvod
BYCHIPS je distribuční odrůda pro LE8577LFJCT, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu LE8577LFJCT e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | LE8577LFJCT |
| Rozšířený popis: | Telecom IC |
| Popis: | IC SLIC 2CH 58 DB LG BAL 44PLCC |
| Email: | [email protected] |
Související díly pro LE8577LFJCT
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CPC7582BCTR | IXYS Integrated Circuits Division | IC SWITCH LINE CARD ACC 16SOIC | Dotaz |
 |
LE8577LFJC | Microsemi Corporation | IC SLIC 2CH 58 DB LG BAL 44PLCC | Dotaz |
 |
XRT7300IVTR | Exar Corporation | IC LIU E3/DS3/STS-1 SGL 44TQFP | Dotaz |
|
ZL50235/GDC | Microsemi Corporation | IC VOICE ECHO CANCELLER 208LBGA | Dotaz |
 |
TP3404V | Texas Instruments | IC ADAPTER DIG QDASL QUAD 28PLCC | Dotaz |
|
CPC7601KTR | IXYS Integrated Circuits Division | IC ANALOG SWITCH 16CH 48-LQFP | Dotaz |
|
MT8986APR1 | Microsemi Corporation | IC TDM/TSI SWITCH 512X256 44PLCC | Dotaz |
 |
LT1684CS#PBF | Linear Technology | IC RING TONE GENERATOR 14-SOIC | Dotaz |
 |
XRT73L02MIVTR-F | Exar Corporation | IC LIU E3/DS3/STS-1 2CH 100TQFP | Dotaz |
|
XRT75L00DIV-F | Exar Corporation | IC LIU E3/DS3/STS-1 SGL 52TQFP | Dotaz |
 |
MT9076BP1 | Microsemi Corporation | IC TXRX SGL T1/E1/J1 3.3V 68PLCC | Dotaz |
 |
DS3150TNC1+ | Maxim Integrated | IC LIU DS3/E3/STS-1 48LQFP | Dotaz |
 |
PEF 22552 E V1.1 | Infineon Technologies | IC LIU E1/T1/J1 160LBGA | Dotaz |
|
DS3112D1 | Maxim Integrated | IC MUX FRAMER T3 E3 256BGA | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers