Koupit IRFC4468ED s BYCHPS
Koupit se zárukou
IRFC4468ED
- Part Number:
- IRFC4468ED
- Popis:
- MOSFET N-CH WAFER
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15675 Pieces
- Datový list:
- IRFC4468ED.pdf
Úvod
BYCHIPS je distribuční odrůda pro IRFC4468ED, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu IRFC4468ED e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | IRFC4468ED |
| Rozšířený popis: | |
| Popis: | MOSFET N-CH WAFER |
| Email: | [email protected] |
Související díly pro IRFC4468ED
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
IRFC4310EF | Infineon Technologies | MOSFET N-CH 100V DIE ON FILM | Dotaz |
|
IRFC4568EF | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4227ED | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4127ED | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4104EB | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4668EF | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4368D | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4010EB | Infineon Technologies | MOSFET N-CH 100V DIE ON WAFER | Dotaz |
|
IRFC4227EB | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4115EB | Infineon Technologies | MOSFET N-CH 150V DIE ON WAFER | Dotaz |
|
IRFC4410ZEB | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4020D | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4468D | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4768ED | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4115ED | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
|
IRFC4668D | Infineon Technologies | MOSFET N-CH WAFER | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers