Koupit FH102A-TR-E s BYCHPS
Koupit se zárukou
FH102A-TR-E
- Part Number:
- FH102A-TR-E
- Popis:
- TRANS NPN DUAL 10V 70MA MCP6
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13229 Pieces
- Datový list:
- FH102A-TR-E.pdf
Úvod
BYCHIPS je distribuční odrůda pro FH102A-TR-E, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu FH102A-TR-E e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - kolektoru emitoru Breakdown (Max): | 10V |
|---|---|
| Transistor Type: | 2 NPN (Dual) |
| Dodavatel zařízení Package: | 6-MCP |
| Série: | - |
| Power - Max: | 500mW |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 6-TSSOP, SC-88, SOT-363 |
| Provozní teplota: | 150°C (TJ) |
| Hluk Obrázek (dB Typ @ f): | 1dB @ 1GHz |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | FH102A-TR-E |
| Získat: | 12dB |
| Frekvence - Přechod: | 7GHz |
| Rozšířený popis: | RF Transistor 2 NPN (Dual) 10V 70mA 7GHz 500mW Surface Mount 6-MCP |
| Popis: | TRANS NPN DUAL 10V 70MA MCP6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 90 @ 20mA, 5V |
| Proud - Collector (Ic) (Max): | 70mA |
| Email: | [email protected] |
Související díly pro FH102A-TR-E
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
NE462M02-AZ | CEL | RF TRANSISTOR NPN SOT-90 | Dotaz |
 |
NE68119-T1 | CEL | TRANS NPN 1GHZ SMD | Dotaz |
 |
BFG25AW/X,115 | NXP USA Inc. | TRANS RF NPN 5GHZ 5V SOT343 | Dotaz |
 |
MMBTH34 | Fairchild/ON Semiconductor | TRANSISTOR RF NPN SOT-23 | Dotaz |
 |
2SC5347AE-TD-E | ON Semiconductor | TRANS NPN BIPO HI FREQ PCP | Dotaz |
 |
MS2206 | Microsemi Corporation | TRANS RF BIPO 7.5W 1A M115 | Dotaz |
|
NE46134-T1-AZ | CEL | RF TRANSISTOR NPN SOT-89 | Dotaz |
 |
2SC5509-A | CEL | RF TRANSISTOR NPN SOT-343F | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers