Koupit F475R07W1H3B11ABOMA1 s BYCHPS
Koupit se zárukou
F475R07W1H3B11ABOMA1
- Part Number:
- F475R07W1H3B11ABOMA1
- Popis:
- IGBT MODULES
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17996 Pieces
- Datový list:
- F475R07W1H3B11ABOMA1.pdf
Úvod
BYCHIPS je distribuční odrůda pro F475R07W1H3B11ABOMA1, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu F475R07W1H3B11ABOMA1 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Ostatní jména: | SP001050464 |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 14 Weeks |
| Výrobní číslo výrobce: | F475R07W1H3B11ABOMA1 |
| Rozšířený popis: | IGBT Module |
| Popis: | IGBT MODULES |
| Email: | [email protected] |
Související díly pro F475R07W1H3B11ABOMA1
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
MG17200D-BN4MM | Littelfuse Inc. | IGBT MOD 1700V 200A PKG D CRCT:B | Dotaz |
 |
VII25-06P1 | IXYS | MOD IGBT PHASE LEG 600V ECOPAC2 | Dotaz |
 |
APTGL475DA120D3G | Microsemi Corporation | IGBT 1200V 610A 2080W D3 | Dotaz |
 |
IXGN60N60C2D1 | IXYS | IGBT 600V 75A SOT-227B | Dotaz |
 |
CM300DY-24A | Powerex Inc. | IGBT MOD DUAL 1200V 300A A SER | Dotaz |
 |
F475R07W2H3B51BOMA1 | Infineon Technologies | MOD DIODE BRIDGE EASY2B-2-1 | Dotaz |
|
MIXA20WB1200TML | IXYS | IGBT MODULE 1200V 20A HEX | Dotaz |
 |
VS-GB55NA120UX | Vishay Semiconductor Diodes Division | IGBT 1200V 55A HS CHOPPER SOT227 | Dotaz |
 |
APTGT150DA60T1G | Microsemi Corporation | IGBT BOOST CHOP 600V 225A SP1 | Dotaz |
 |
APT100GF60JU2 | Microsemi Corporation | IGBT 600V 120A 416W SOT227 | Dotaz |
|
VDI125-12P1 | IXYS | MOD IGBT BUCK 1200V ECO-PAC2 | Dotaz |
|
APTGT225DU170G | Microsemi Corporation | IGBT MOD TRENCH DUAL SOURCE SP6 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers