Koupit CKG45NX7R1H335M500JJ s BYCHPS
Koupit se zárukou
CKG45NX7R1H335M500JJ
- Part Number:
- CKG45NX7R1H335M500JJ
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 3.3UF 50V X7R SMD
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13346 Pieces
Úvod
BYCHIPS je distribuční odrůda pro CKG45NX7R1H335M500JJ, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu CKG45NX7R1H335M500JJ e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 50V |
|---|---|
| Tolerance: | ±20% |
| Tloušťka (Max): | 0.217" (5.50mm) |
| teplotní koeficient: | X7R |
| Velikost / Rozměry: | 0.197" L x 0.138" W (5.00mm x 3.50mm) |
| Série: | MEGACAP, CKG |
| hodnocení: | AEC-Q200 |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Stacked SMD, 2 J-Lead |
| Ostatní jména: | 445-10409-2 CKG45NX7R1H335MT0Y9W |
| Provozní teplota: | -55°C ~ 125°C |
| Typ montáže: | Surface Mount, MLCC |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 18 Weeks |
| Výrobní číslo výrobce: | CKG45NX7R1H335M500JJ |
| Lead Style: | J-Lead |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | Low ESL (Stacked) |
| Poruchovost: | - |
| Rozšířený popis: | 3.3µF ±20% 50V Ceramic Capacitor X7R Stacked SMD, 2 J-Lead |
| Popis: | CAP CER 3.3UF 50V X7R SMD |
| kapacitní: | 3.3µF |
| Aplikace: | Automotive, SMPS Filtering, Bypass, Decoupling |
| Email: | [email protected] |
Související díly pro CKG45NX7R1H335M500JJ
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
CKG45NX7R1E106M500JH | TDK Corporation | CAP CER 10UF 25V X7R SMD | Dotaz |
|
CKG45NX7R1H335M500JH | TDK Corporation | CAP CER 3.3UF 50V X7R SMD | Dotaz |
|
CKG45NX7T2J334M500JJ | TDK Corporation | CAP CER 0.33UF 630V X7T SMD | Dotaz |
|
CKG45NX7R2E105M500JJ | TDK Corporation | CAP CER 1UF 250V X7R SMD | Dotaz |
|
CKG45NX7R1H685M500JJ | TDK Corporation | CAP CER 6.8UF 50V X7R SMD | Dotaz |
|
CKG45NX7S1C476M500JJ | TDK Corporation | CAP CER 47UF 16V X7S SMD | Dotaz |
|
CKG45NX7R1C226M500JH | TDK Corporation | CAP CER 22UF 16V X7R SMD | Dotaz |
|
CKG45NX7R1C226M500JJ | TDK Corporation | CAP CER 22UF 16V X7R SMD | Dotaz |
|
CKG45NX7R1H685M500JH | TDK Corporation | CAP CER 6.8UF 50V X7R SMD | Dotaz |
|
CKG45NX7R2A225M500JH | TDK Corporation | CAP CER 2.2UF 100V X7R SMD | Dotaz |
|
CKG45NX7S2A685M500JJ | TDK Corporation | CAP CER 6.8UF 100V X7S SMD | Dotaz |
|
CKG45NX7T2E225M500JH | TDK Corporation | CAP CER 2.2UF 250V X7T SMD | Dotaz |
|
CKG45NX7R1E106M500JJ | TDK Corporation | CAP CER 10UF 25V X7R SMD | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers