Koupit C0816X5R0J475M050AC s BYCHPS
Koupit se zárukou
C0816X5R0J475M050AC
- Part Number:
- C0816X5R0J475M050AC
- Výrobce:
- TDK Corporation
- Popis:
- CAP CER 4.7UF 6.3V X5R 0306
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15573 Pieces
- Datový list:
- C0816X5R0J475M050AC.pdf
Úvod
BYCHIPS je distribuční odrůda pro C0816X5R0J475M050AC, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu C0816X5R0J475M050AC e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 6.3V |
|---|---|
| Tolerance: | ±20% |
| Tloušťka (Max): | 0.035" (0.90mm) |
| teplotní koeficient: | X5R |
| Velikost / Rozměry: | 0.031" L x 0.063" W (0.80mm x 1.60mm) |
| Série: | C |
| hodnocení: | - |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 0306 (0816 Metric) |
| Ostatní jména: | 445-13745-2 C0816X5R0J475MT005N |
| Provozní teplota: | -55°C ~ 85°C |
| Typ montáže: | Surface Mount, MLCC |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | C0816X5R0J475M050AC |
| Lead Style: | - |
| Rozestup vývodù: | - |
| Výška - Sedící (Max): | - |
| Funkce: | Low ESL (Reverse Geometry) |
| Poruchovost: | - |
| Rozšířený popis: | 4.7µF ±20% 6.3V Ceramic Capacitor X5R 0306 (0816 Metric) |
| Popis: | CAP CER 4.7UF 6.3V X5R 0306 |
| kapacitní: | 4.7µF |
| Aplikace: | Bypass, Decoupling |
| Email: | [email protected] |
Související díly pro C0816X5R0J475M050AC
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
C0816X5R1C104M050AC | TDK Corporation | CAP CER 0.1UF 16V X5R 0306 | Dotaz |
|
C0816X5R1C473M050AC | TDK Corporation | CAP CER 0.047UF 16V X5R 0306 | Dotaz |
|
C0816X5R1C105M050AC | TDK Corporation | CAP CER 1UF 16V X5R 0306 | Dotaz |
|
C0816X5R1C223M050AC | TDK Corporation | CAP CER 0.022UF 16V X5R 0306 | Dotaz |
|
C0816X5R0J474M050AC | TDK Corporation | CAP CER 0.47UF 6.3V X5R 0306 | Dotaz |
|
C0816X5R0J474K | TDK Corporation | CAP CER 0.47UF 6.3V X5R 0306 | Dotaz |
|
C0816X5R1C103M050AC | TDK Corporation | CAP CER 10000PF 16V X5R 0306 | Dotaz |
|
C0816X5R1A474K | TDK Corporation | CAP CER 0.47UF 10V X5R 0306 | Dotaz |
|
C0816X5R1A224K | TDK Corporation | CAP CER 0.22UF 10V X5R 0306 | Dotaz |
|
C0816X5R0J105M050AC | TDK Corporation | CAP CER 1UF 6.3V X5R 0306 | Dotaz |
|
C0816X5R0J225M050AC | TDK Corporation | CAP CER 2.2UF 6.3V X5R 0306 | Dotaz |
|
C0816X5R1A224M050AC | TDK Corporation | CAP CER 0.22UF 10V X5R 0306 | Dotaz |
|
C0816X5R1A474M050AC | TDK Corporation | CAP CER 0.47UF 10V X5R 0306 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers