Koupit BD3817KS s BYCHPS
Koupit se zárukou
BD3817KS
- Part Number:
- BD3817KS
- Výrobce:
- LAPIS Semiconductor
- Popis:
- IC SOUND PROCESSOR 100SQFP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14591 Pieces
- Datový list:
- BD3817KS.pdf
Úvod
BYCHIPS je distribuční odrůda pro BD3817KS, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu BD3817KS e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 5 V ~ 7.3 V |
|---|---|
| Dodavatel zařízení Package: | 100-SQFP (14x20) |
| Specifikace: | 132dB |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 100-BQFP |
| Ostatní jména: | BD3817KSCT BD3817KSCT-ND BD3817KSTR BD3817KSTR-ND |
| Provozní teplota: | -20°C ~ 75°C (TA) |
| Počet kanálů: | 7 |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní standardní doba výroby: | 7 Weeks |
| Výrobní číslo výrobce: | BD3817KS |
| Rozhraní: | Serial |
| Funkce: | Audio Signal Processor |
| Rozšířený popis: | Audio Audio Signal Processor 7 Channel 100-SQFP (14x20) |
| Popis: | IC SOUND PROCESSOR 100SQFP |
| Aplikace: | Consumer Audio |
| Email: | [email protected] |
Související díly pro BD3817KS
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
LC823430TA-2H | ON Semiconductor | IC AUDIO LSI RECORDER 128TQFP | Dotaz |
 |
BD3814FV-E2 | Rohm Semiconductor | IC SOUND PROCESSOR 6CH 40SSOP | Dotaz |
 |
BD3813KS-E2 | Rohm Semiconductor | IC SOUND PROCESSOR 6CH 56SQFP | Dotaz |
 |
TDA7439 | STMicroelectronics | IC PROCESSOR AUDIO DGTL 30-SDIP | Dotaz |
 |
BD3811K1 | Rohm Semiconductor | IC SOUND PROCESSOR 8CH 80QFP | Dotaz |
|
BD3816K1 | Rohm Semiconductor | IC SOUND PROCESSORS 80-QFP | Dotaz |
 |
BD3818KS | Rohm Semiconductor | IC SOUND PROCESSOR 80SQFP | Dotaz |
 |
BD3812F-E2 | Rohm Semiconductor | IC SOUND PROCESSOR 2CH 14SOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers