Koupit AT88SA102S-TSU-T s BYCHPS
Koupit se zárukou
AT88SA102S-TSU-T
- Part Number:
- AT88SA102S-TSU-T
- Výrobce:
- Micrel / Microchip Technology
- Popis:
- IC PROD AUTHENTICATION SOT23-3
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 17549 Pieces
- Datový list:
- 1.AT88SA102S-TSU-T.pdf2.AT88SA102S-TSU-T.pdf
Úvod
BYCHIPS je distribuční odrůda pro AT88SA102S-TSU-T, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu AT88SA102S-TSU-T e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Authentication Chip |
|---|---|
| Dodavatel zařízení Package: | SOT-23-3 |
| Série: | CryptoAuthentication™ |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | TO-236-3, SC-59, SOT-23-3 |
| Ostatní jména: | AT88SA102S-TSU-T-ND |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | AT88SA102S-TSU-T |
| Rozšířený popis: | Authentication Chip IC Networking and Communications SOT-23-3 |
| Popis: | IC PROD AUTHENTICATION SOT23-3 |
| Aplikace: | Networking and Communications |
| Email: | [email protected] |
Související díly pro AT88SA102S-TSU-T
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
AT88SA100S-TH-T | Microchip Technology | IC BATTERY AUTHENTICATION 8TSSOP | Dotaz |
 |
AT88SA10HS-SH-T | Microchip Technology | IC HOST AUTHENTICATION 8SOIC | Dotaz |
|
AT88SA10HS-TSU-T | Microchip Technology | IC HOST AUTHENTICATION SOT23-3 | Dotaz |
|
AT88SA102S-SH-T | Microchip Technology | IC BATTERY AUTHENTICATION 8SOIC | Dotaz |
|
AT88SA100S-SH-T | Microchip Technology | IC BATTERY AUTHENTICATION 8SOIC | Dotaz |
|
AT88SA102S-TH-T | Microchip Technology | IC PRODUCT AUTHENTICATION 8TSSOP | Dotaz |
|
AT88SA100S-TSU-T | Microchip Technology | IC BATT AUTHENTICATION SOT23-3 | Dotaz |
|
AT88SA10HS-TH-T | Microchip Technology | IC HOST AUTHENTICATION 8TSSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers