Koupit APXH6R3ARA820MF60G s BYCHPS
Koupit se zárukou
APXH6R3ARA820MF60G
- Part Number:
- APXH6R3ARA820MF60G
- Výrobce:
- Nippon Chemi-Con
- Popis:
- CAP ALUM POLY 82UF 20% 6.3V SMD
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16599 Pieces
- Datový list:
- APXH6R3ARA820MF60G.pdf
Úvod
BYCHIPS je distribuční odrůda pro APXH6R3ARA820MF60G, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu APXH6R3ARA820MF60G e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| napìtí: | 6.3V |
|---|---|
| Typ: | Polymer |
| Tolerance: | ±20% |
| Povrchová montáž Land Velikost: | 0.260" L x 0.260" W (6.60mm x 6.60mm) |
| Velikost / Rozměry: | 0.248" Dia (6.30mm) |
| Série: | NPCAP™-PXH |
| Zvlněný proud - nízká frekvence: | - |
| Zvlněný proud - vysoká frekvence: | 2.4A @ 100kHz |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | Radial, Can - SMD |
| Ostatní jména: | 565-3159-2 PXH6.3VC82RMF60TP |
| Provozní teplota: | -55°C ~ 125°C |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 15 Weeks |
| Výrobní číslo výrobce: | APXH6R3ARA820MF60G |
| Životnost @ Temp.: | 1000 Hrs @ 125°C |
| Rozestup vývodù: | - |
| Impedance: | - |
| Výška - Sedící (Max): | 0.224" (5.70mm) |
| Rozšířený popis: | 82µF ±20% 6.3V Aluminum Polymer Capacitor Radial, Can - SMD 40 mOhm 1000 Hrs @ 125°C |
| ESR (Equivalent Resistance Series): | 40 mOhm |
| Popis: | CAP ALUM POLY 82UF 20% 6.3V SMD |
| kapacitní: | 82µF |
| Aplikace: | - |
| Email: | [email protected] |
Související díly pro APXH6R3ARA820MF60G
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
APXH6R3ARA471MJ80G | United Chemi-Con | CAP ALUM POLY 470UF 20% 6.3V SMD | Dotaz |
 |
870025375010 | Wurth Electronics Inc. | CAP ALUM POLY 820UF 20% 16V T/H | Dotaz |
 |
875115150001 | Wurth Electronics Inc. | CAP ALUM POLY 220UF 20% 6.3V SMD | Dotaz |
 |
PLF0E681MCO1 | Nichicon | CAP ALUM POLY 680UF 20% 2.5V T/H | Dotaz |
 |
HHXC630ARA330MJA0G | United Chemi-Con | CONDUCTIVE POLYMER HYBRID ALUMIN | Dotaz |
 |
94SVP336X0025E12 | Vishay Sprague | CAP ALUM POLY 33UF 20% 25V SMD | Dotaz |
 |
APSC6R3ELL561MH08S | United Chemi-Con | CAP ALUM POLY 560UF 20% 6.3V T/H | Dotaz |
 |
APXH6R3ARA101MF60G | United Chemi-Con | CAP ALUM POLY 100UF 20% 6.3V SMD | Dotaz |
 |
APXH6R3ARA151MH70G | United Chemi-Con | CAP ALUM POLY 150UF 20% 6.3V SMD | Dotaz |
 |
2.5SWZ270M1.9X7.3 | Rubycon | CAP ALUM POLY 270UF 20% 2.5V SMD | Dotaz |
 |
SPSX331M0ER | Cornell Dubilier Electronics (CDE) | CAP ALUM POLY 330UF 20% 2.5V SMD | Dotaz |
 |
PLX1C221MDL1 | Nichicon | CAP ALUM POLY 220UF 20% 16V T/H | Dotaz |
|
APXH6R3ARA221MH70G | United Chemi-Con | CAP ALUM POLY 220UF 20% 6.3V SMD | Dotaz |
 |
RSS0J331MCN1GS | Nichicon | CAP ALUM POLY 330UF 20% 6.3V SMD | Dotaz |
 |
127AVG050MGBJ | Illinois Capacitor | CAP ALUM POLY 120UF 20% 50V T/H | Dotaz |
 |
6SEPC560MX+TSS | Panasonic Electronic Components | CAP ALUM POLY 560UF 20% 6.3V T/H | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers