Koupit APF10209 s BYCHPS
Koupit se zárukou
APF10209
- Part Number:
- APF10209
- Výrobce:
- Panasonic
- Popis:
- APF RELAY 1 FORM A 9V
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14587 Pieces
- Datový list:
- APF10209.pdf
Úvod
BYCHIPS je distribuční odrůda pro APF10209, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu APF10209 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 10 Weeks |
| Výrobní číslo výrobce: | APF10209 |
| Rozšířený popis: | Relay Coil |
| Popis: | APF RELAY 1 FORM A 9V |
| Email: | [email protected] |
Související díly pro APF10209
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
APF10205 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 5V | Dotaz |
|
APF10305 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 5V | Dotaz |
|
APF10206 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 6V | Dotaz |
 |
APF10248 | Panasonic Electric Works | APF RELAY 1 FORM A 48V | Dotaz |
|
APF10218 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 18V | Dotaz |
|
APF1024H | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 4.5V | Dotaz |
|
APF10224 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 24V | Dotaz |
|
APF10260 | Panasonic Electric Works | APF RELAY 1 FORM A 60V | Dotaz |
|
APF10360 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 60V | Dotaz |
|
APF10324 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 24V | Dotaz |
|
APF10318 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 18V | Dotaz |
|
APF10212 | Panasonic Electric Works | RELAY GEN PURPOSE SPST 6A 12V | Dotaz |
|
APF10309 | Panasonic Electric Works | APF RELAY 1 FORM A 9V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers