Koupit ALS81H303QT250 s BYCHPS
Koupit se zárukou
ALS81H303QT250
- Part Number:
- ALS81H303QT250
- Výrobce:
- KEMET
- Popis:
- ALU SCREW TERMINAL 30000UF 250V
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16016 Pieces
- Datový list:
- ALS81H303QT250.pdf
Úvod
BYCHIPS je distribuční odrůda pro ALS81H303QT250, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu ALS81H303QT250 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 13 Weeks |
| Výrobní číslo výrobce: | ALS81H303QT250 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | ALU SCREW TERMINAL 30000UF 250V |
| Email: | [email protected] |
Související díly pro ALS81H303QT250
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
ALS81H303LM100 | KEMET | ALU SCREW TERMINAL 30000UF 100V | Dotaz |
|
ALS81H303DA025 | KEMET | ALU SCREW TERMINAL 30000UF 25V | Dotaz |
|
ALS81H304MF025 | KEMET | ALU SCREW TERMINAL 300000UF 25V | Dotaz |
|
ALS81H301DA500 | KEMET | ALU SCREW TERMINAL 300UF 500V | Dotaz |
|
ALS81H302DA100 | KEMET | ALU SCREW TERMINAL 3000UF 100V | Dotaz |
|
ALS81H303MF100 | KEMET | ALU SCREW TERMINAL 30000UF 100V | Dotaz |
|
ALS81H303QS250 | KEMET | ALU SCREW TERMINAL 30000UF 250V | Dotaz |
|
ALS81H302DF200 | KEMET | ALU SCREW TERMINAL 3000UF 200V | Dotaz |
|
ALS81H304QS063 | KEMET | ALU SCREW TERMINAL 300000UF 63V | Dotaz |
|
ALS81H302KE250 | KEMET | ALU SCREW TERMINAL 3000UF 250V | Dotaz |
|
ALS81H304NW040 | KEMET | ALU SCREW TERMINAL 300000UF 40V | Dotaz |
|
ALS81H304LM025 | KEMET | ALU SCREW TERMINAL 300000UF 25V | Dotaz |
|
ALS81H303KE063 | KEMET | ALU SCREW TERMINAL 30000UF 63V | Dotaz |
|
ALS81H303NS200 | KEMET | ALU SCREW TERMINAL 30000UF 200V | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers