Koupit 78P2351R-IM/F s BYCHPS
Koupit se zárukou
78P2351R-IM/F
- Part Number:
- 78P2351R-IM/F
- Výrobce:
- Maxim Integrated
- Popis:
- IC LIU NRZ-CMI CONV 155M 56-QFN
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13951 Pieces
- Datový list:
- 78P2351R-IM/F.pdf
Úvod
BYCHIPS je distribuční odrůda pro 78P2351R-IM/F, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 78P2351R-IM/F e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Supply: | 3.15 V ~ 3.45 V |
|---|---|
| Dodavatel zařízení Package: | 56-QFN (7x7) |
| Série: | - |
| Příkon (W): | - |
| Obal: | Tube |
| Paket / krabice: | 56-VFQFN Exposed Pad |
| Provozní teplota: | -40°C ~ 85°C |
| Počet okruhů: | 1 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | 78P2351R-IM/F |
| Rozhraní: | - |
| Zahrnuje: | - |
| Funkce: | - |
| Rozšířený popis: | Telecom IC 56-QFN (7x7) |
| Popis: | IC LIU NRZ-CMI CONV 155M 56-QFN |
| Proud - Supply: | - |
| Email: | [email protected] |
Související díly pro 78P2351R-IM/F
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
78P2352-IEL/F | Maxim Integrated | IC LIU SDH SONET 2CH 128-LQFP | Dotaz |
|
78P2351-IGT/F | Maxim Integrated | IC LINE INTERFACE UNIT 100LQFP | Dotaz |
|
78P2351R-IMR/F | Maxim Integrated | IC LIU NRZ-CMI CONV 155M 56-QFN | Dotaz |
|
78P2352-IGTR/F | Maxim Integrated | IC LIU SDH SONET 2CH 128-LQFP | Dotaz |
|
DS21Q354C1 | Maxim Integrated | IC TXRX QUAD E1 208MCM BGA | Dotaz |
|
78P2352-IELR/F | Maxim Integrated | IC LIU SDH SONET 2CH 128-LQFP | Dotaz |
|
78P2352-IGT/F | Maxim Integrated | IC LIU SDH SONET 2CH 128-LQFP | Dotaz |
 |
CYP15G0402DXB-BGC | Cypress Semiconductor Corp | IC SERDES HOTLINK 256LBGA | Dotaz |
|
78P2351-IGTR/F | Maxim Integrated | IC LINE INTERFACE UNIT 100LQFP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers