Koupit 74SSTVF16857PAG8 s BYCHPS
Koupit se zárukou
74SSTVF16857PAG8
- Part Number:
- 74SSTVF16857PAG8
- Popis:
- IC BUFFER 14BIT SSTL I/O 48TSSOP
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13184 Pieces
- Datový list:
- 1.74SSTVF16857PAG8.pdf2.74SSTVF16857PAG8.pdf
Úvod
BYCHIPS je distribuční odrůda pro 74SSTVF16857PAG8, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 74SSTVF16857PAG8 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napájení: | 2.3 V ~ 2.7 V |
|---|---|
| Dodavatel zařízení Package: | 48-TSSOP |
| Série: | 74SSTVF |
| Obal: | Tape & Reel (TR) |
| Paket / krabice: | 48-TFSOP (0.240", 6.10mm Width) |
| Ostatní jména: | IDT74SSTVF16857PAG8 IDT74SSTVF16857PAG8-ND |
| Provozní teplota: | -40°C ~ 85°C |
| Počet bitů: | 14 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní číslo výrobce: | 74SSTVF16857PAG8 |
| Typ logiky: | Registered Buffer with SSTL_2 Compatible I/O for DDR |
| Rozšířený popis: | Registered Buffer with SSTL_2 Compatible I/O for DDR IC 48-TSSOP |
| Popis: | IC BUFFER 14BIT SSTL I/O 48TSSOP |
| Email: | [email protected] |
Související díly pro 74SSTVF16857PAG8
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
74SSTVF16859NLG | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 56VFQFPN | Dotaz |
|
74SSTVF16857PAG | IDT, Integrated Device Technology Inc | IC BUFFER 14BIT SSTL I/O 48TSSOP | Dotaz |
|
74SSTVF16859NLG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 56VFQFPN | Dotaz |
|
74SSTVF16859PAG8 | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Dotaz |
|
74SSTVF16859PAG | IDT, Integrated Device Technology Inc | IC BUFFER 13-26BIT SSTL 64-TSSOP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers