Koupit 74SSTUAE32866ABFG s BYCHPS
Koupit se zárukou
74SSTUAE32866ABFG
- Part Number:
- 74SSTUAE32866ABFG
- Popis:
- IC BUFFER 25BIT CONF REG 96-BGA
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16492 Pieces
- Datový list:
- 74SSTUAE32866ABFG.pdf
Úvod
BYCHIPS je distribuční odrůda pro 74SSTUAE32866ABFG, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 74SSTUAE32866ABFG e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napájení: | 1.425 V ~ 1.575 V |
|---|---|
| Dodavatel zařízení Package: | 96-CABGA (13.5x5.5) |
| Série: | - |
| Obal: | Tray |
| Paket / krabice: | 96-LFBGA |
| Ostatní jména: | IDT74SSTUAE32866ABFG IDT74SSTUAE32866ABFG-ND |
| Provozní teplota: | 0°C ~ 70°C |
| Počet bitů: | 25, 14 |
| Typ montáže: | Surface Mount |
| Úroveň citlivosti na vlhkost (MSL): | 3 (168 Hours) |
| Výrobní číslo výrobce: | 74SSTUAE32866ABFG |
| Typ logiky: | 1:2 Configurable Registered Buffer |
| Rozšířený popis: | 1:2 Configurable Registered Buffer IC 96-CABGA (13.5x5.5) |
| Popis: | IC BUFFER 25BIT CONF REG 96-BGA |
| Email: | [email protected] |
Související díly pro 74SSTUAE32866ABFG
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
SSTVF16859BS,118 | NXP USA Inc. | IC REG BUFF 13BIT SSTL 56HVQFN | Dotaz |
 |
74SSTUAE32866ABFG8 | IDT, Integrated Device Technology Inc | IC BUFFER 25BIT CONF REG 96-BGA | Dotaz |
 |
SN74ABT8952DWR | Texas Instruments | IC SCAN TEST DEVICE 28SOIC | Dotaz |
 |
SSTUH32864EC/G,557 | NXP USA Inc. | IC BUFFER 1.8V 1/14BIT SOT536-1 | Dotaz |
 |
SY100EL16VBZC TR | Microchip Technology | IC RCVR DIFF 5V/3.3V 8-SOIC | Dotaz |
 |
MC10EL16DTR2G | ON Semiconductor | IC RCVR ECL DIFFERENTL 5V 8TSSOP | Dotaz |
|
SN74LVC1404DCURG4 | Texas Instruments | IC OSCILLATOR DRIVER US8 | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers