Koupit 63VXG10000M35X50 s BYCHPS
Koupit se zárukou
63VXG10000M35X50
- Part Number:
- 63VXG10000M35X50
- Výrobce:
- Rubycon
- Popis:
- CAP ALUM
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15474 Pieces
- Datový list:
- 1.63VXG10000M35X50.pdf2.63VXG10000M35X50.pdf
Úvod
BYCHIPS je distribuční odrůda pro 63VXG10000M35X50, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 63VXG10000M35X50 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 63VXG10000M35X50 |
| Rozšířený popis: | Aluminum Capacitors |
| Popis: | CAP ALUM |
| Email: | [email protected] |
Související díly pro 63VXG10000M35X50
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
63VXG2200MEFC30X25 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63VXG3900MEFC35X30 | Rubycon | CAP ALUM 3900UF 20% 63V SNAP | Dotaz |
|
63VXG8200MEFC35X50 | Rubycon | CAP ALUM 8200UF 20% 63V SNAP | Dotaz |
|
63VXG8200MEFCSN35X50 | Rubycon | CAP ALUM 8200UF 20% 63V SNAP | Dotaz |
|
63VXG1200MEFC22X25 | Rubycon | CAP ALUM 1200UF 20% 63V SNAP | Dotaz |
|
63VXG2200MEFCSN25X30 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63VXG1000MEFC22X25 | Rubycon | CAP ALUM 1000UF 20% 63V SNAP | Dotaz |
|
63VXG3300MEFCSN30X30 | Rubycon | CAP ALUM 3300UF 20% 63V SNAP | Dotaz |
|
63VXG2200MEFC25X30 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63VXG2200MEFC22X40 | Rubycon | CAP ALUM 2200UF 20% 63V SNAP | Dotaz |
|
63VXG3900MEFC25X45 | Rubycon | CAP ALUM 3900UF 20% 63V SNAP | Dotaz |
|
63VXG3300MEFC30X30 | Rubycon | CAP ALUM 3300UF 20% 63V SNAP | Dotaz |
|
63VXG1500MEFC22X30 | Rubycon | CAP ALUM 1500UF 20% 63V SNAP | Dotaz |
|
63VXG1500MEFC25X25 | Rubycon | CAP ALUM 1500UF 20% 63V SNAP | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers