Koupit 27E447 s BYCHPS
Koupit se zárukou
27E447
- Part Number:
- 27E447
- Popis:
- RELAY SOCKET 4 POLE SOLDER
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14677 Pieces
- Datový list:
- 27E447.pdf
Úvod
BYCHIPS je distribuční odrůda pro 27E447, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 27E447 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Typ: | Socket |
|---|---|
| styl koncovky: | Solder Lug |
| Série: | R10 |
| Ostatní jména: | 4-1393143-2 |
| Počet poloh: | 16 |
| Typ montáže: | Chassis Mount |
| Výrobní standardní doba výroby: | 16 Weeks |
| Výrobní číslo výrobce: | 27E447 |
| Pro použití s / příbuzné výrobky: | R10 Series |
| Funkce: | Grounding Strip |
| Rozšířený popis: | Relay Socket Chassis Mount |
| Popis: | RELAY SOCKET 4 POLE SOLDER |
| Email: | [email protected] |
Související díly pro 27E447
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
6-1415035-1 | TE Connectivity Potter & Brumfield Relays | SOCKET 5MM W/SCREW TERM DIN | Dotaz |
 |
27E448 | TE Connectivity Potter & Brumfield Relays | RELAY SOCKET 6 POLE SOLDER | Dotaz |
 |
PY08-QN | Omron Automation and Safety | SOCKET BACK-CONNECTING FOR MY | Dotaz |
 |
JRS400200 | Amphenol PCD | QUICK MOUNT, 4 POLE | Dotaz |
 |
27E446 | TE Connectivity Potter & Brumfield Relays | SOCKET FLANGE MNT DP R10 SERIES | Dotaz |
 |
JW2-PS | Panasonic Electric Works | SOCKET PCB FOR JW2 RELAYS | Dotaz |
|
RSE116693 | Amphenol PCD | LOW PROFILE, 2 POLE/10 AMP, WC | Dotaz |
|
154746-1 | TE Connectivity Potter & Brumfield Relays | RELAY BASE HSG. NATURAL | Dotaz |
|
RSE116761 | Amphenol PCD | LOW PROFILE, 6 POLE/10 AMP, WC | Dotaz |
 |
P7LF-06 | Omron Electronics Inc-EMC Div | RELAY SOCKET SCREW FOR G7L SER | Dotaz |
 |
03540551Z | Littelfuse Inc. | RELAY SOCKET HOUSING 280 MICRO | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers