Koupit 170M7286-L s BYCHPS
Koupit se zárukou
170M7286-L
- Part Number:
- 170M7286-L
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 800A 1000V 2//3L L
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 15638 Pieces
- Datový list:
- 170M7286-L.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M7286-L, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M7286-L e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 170M7286-L |
| Typ pojistky: | Square |
| Popis: | FUSE 800A 1000V 2//3L L |
| Email: | [email protected] |
Související díly pro 170M7286-L
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M7286-S | Eaton | FUSE 800A 1000V 2//3L S | Dotaz |
|
170M7292 | Eaton | FUSE 50A 1000V AC | Dotaz |
|
170M7294 | Eaton | FUSE 80A 1000V AC | Dotaz |
|
170M7272 | Eaton | FUSE 4500A 660V IEC 24PKN/60 AR | Dotaz |
|
170M7221 | Eaton | FUSE 3500A 660V 24GKN/60 AR | Dotaz |
|
170M7250-B | Eaton | FUSE 1500A 1500V 4BKN/125AR | Dotaz |
|
170M7295 | Eaton | FUSE 100A 1000V AC | Dotaz |
|
170M7291 | Eaton | FUSE 40A 1000V AC | Dotaz |
|
170M7235 | Eaton | FUSE 1900A 1000V 4PKN/90 AR | Dotaz |
|
170M7290 | Eaton | FUSE 32A 1000V AC | Dotaz |
|
170M7255 | Eaton | FUSE 1900A 1500V 4BKN/125AR | Dotaz |
|
170M7293 | Eaton | FUSE 63A 1000V AC | Dotaz |
|
170M7231 | Eaton | FUSE 1700A 1000V 4BKN/95 AR | Dotaz |
|
170M7237 | Eaton | FUSE 1250A 1250V 4BKN/105 AR | Dotaz |
|
170M7250 | Eaton | FUSE 1500A 1500V 4BKN/125AR | Dotaz |
|
170M7212 | Eaton | FUSE 1400A 800V 4SBKN/105 AR | Dotaz |
|
170M7222 | Eaton | FUSE 4000A 660V 24GKN/60 AR | Dotaz |
 |
170M7086 | Eaton | FUSE SQUARE 4KA 690VAC | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers