Koupit 170M5806 s BYCHPS
Koupit se zárukou
170M5806
- Part Number:
- 170M5806
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 315A 690V DIN 2 AR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13470 Pieces
- Datový list:
- 170M5806.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M5806, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M5806 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Série: | * |
|---|---|
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 170M5806 |
| Typ pojistky: | Square |
| Popis: | FUSE 315A 690V DIN 2 AR |
| Email: | [email protected] |
Související díly pro 170M5806
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M5809D | Eaton | FUSE SQ 450A 700VAC RECTANGULAR | Dotaz |
 |
170M5808 | Eaton | FUSE SQ 400A 700VAC RECTANGULAR | Dotaz |
|
170M5804 | Eaton | FUSE 200A 690V DIN 2 AR | Dotaz |
|
170M5876 | Eaton | FUSE 900A 690V 2/110 AR | Dotaz |
|
170M5816D | Eaton | FUSE 1000A 690V AR DIN 2 HSDNH | Dotaz |
|
170M5882 | Eaton | FUSE 250A 690V DIN 2 GR | Dotaz |
|
170M5820D | Eaton | FUSE 900A 690V AR DIN 2 HSDNH | Dotaz |
|
170M5884 | Eaton | FUSE 350A 690V DIN 2 GR | Dotaz |
|
170M5807 | Eaton | FUSE 350A 690V DIN 2 AR | Dotaz |
|
170M5813 | Eaton | FUSE SQ 700A 700VAC RECTANGULAR | Dotaz |
|
170M5808D | Eaton | FUSE SQ 400A 700VAC RECTANGULAR | Dotaz |
|
170M5809 | Eaton | FUSE SQ 450A 700VAC RECTANGULAR | Dotaz |
|
170M5887 | Eaton | FUSE 500A 690V DIN 2 GR | Dotaz |
|
170M5805 | Eaton | FUSE 250A 690V DIN 2 AR | Dotaz |
|
170M5883 | Eaton | FUSE 315A 690V DIN 2 GR | Dotaz |
|
170M5885 | Eaton | FUSE 400A 690V DIN 2 GR | Dotaz |
|
170M5811D | Eaton | FUSE 550A 690V AR DIN 2 HSDNH | Dotaz |
|
170M5810D | Eaton | FUSE SQ 500A 700VAC RECTANGULAR | Dotaz |
|
170M5813D | Eaton | FUSE SQ 700A 700VAC RECTANGULAR | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers