Koupit 170M4985 s BYCHPS
Koupit se zárukou
170M4985
- Part Number:
- 170M4985
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 400A 1000V 1TN/110 AR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14587 Pieces
- Datový list:
- 170M4985.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M4985, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M4985 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 3.150" L x 2.007" W x 2.717" H (80.00mm x 51.00mm x 69.00mm) |
|---|---|
| Série: | * |
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 6 Weeks |
| Výrobní číslo výrobce: | 170M4985 |
| Typ pojistky: | Square |
| Popis: | FUSE 400A 1000V 1TN/110 AR |
| Email: | [email protected] |
Související díly pro 170M4985
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M4926 | Eaton | FUSE 400A 1000V 1GKN/75 AR | Dotaz |
|
170M4981 | Eaton | FUSE 200A 1000V 1TN/110 AR | Dotaz |
|
170M4987 | Eaton | FUSE 500A 1000V 1TN/110 AR | Dotaz |
|
170M4953 | Eaton | FUSE 250A 1000V 1BKN/75 AR | Dotaz |
|
170M4986 | Eaton | FUSE 450A 1000V 1TN/110 AR | Dotaz |
|
170M4974 | Eaton | FUSE 630A 1000V 1KN/110 AR | Dotaz |
|
170M4983 | Eaton | FUSE 315A 1000V 1TN/110 AR | Dotaz |
|
170M4908 | Eaton | FUSE 700A 1000V 1BN/75 AR UC | Dotaz |
|
170M4989 | Eaton | FUSE 630A 1000V 1TN/110 AR | Dotaz |
|
170M4982 | Eaton | FUSE 250A 1000V 1TN/110 AR | Dotaz |
|
170M4980 | Eaton | FUSE 160A 1000V 1TN/110 AR | Dotaz |
|
170M4958 | Eaton | FUSE 500A 1000V 1BKN/75 AR | Dotaz |
|
170M4929 | Eaton | FUSE 550A 1000V 1GKN/75 AR | Dotaz |
|
170M4956 | Eaton | FUSE 400A 1000V 1BKN/75 AR | Dotaz |
|
170M4970 | Eaton | FUSE 400A 1000V 1KN/110 AR | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers