Koupit 170M3955 s BYCHPS
Koupit se zárukou
170M3955
- Part Number:
- 170M3955
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 125A
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 16588 Pieces
- Datový list:
- 170M3955.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170M3955, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170M3955 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | 2.854" L x 1.693" W x 2.402" H (72.50mm x 43.00mm x 61.00mm) |
|---|---|
| Série: | * |
| Obal: | Bulk |
| Paket / krabice: | Rectangular, Blade |
| Typ montáže: | Holder |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 9 Weeks |
| Výrobní číslo výrobce: | 170M3955 |
| Typ pojistky: | Square |
| Popis: | FUSE 125A |
| Email: | [email protected] |
Související díly pro 170M3955
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170M3986 | Eaton | FUSE 160A 1000V | Dotaz |
|
170M3910 | Eaton | FUSE 500A | Dotaz |
|
170M3991 | Eaton | FUSE 400A 1000V | Dotaz |
|
170M3984 | Eaton | FUSE 100A 1000V | Dotaz |
|
170M3961 | Eaton | FUSE 400A | Dotaz |
|
170M3902 | Eaton | FUSE 125A | Dotaz |
|
170M3985 | Eaton | FUSE 125A 1000V | Dotaz |
|
170M3971 | Eaton | FUSE 200A 1000V | Dotaz |
|
170M3989 | Eaton | FUSE 315A 1000V | Dotaz |
|
170M3987 | Eaton | FUSE 200A 1000V | Dotaz |
|
170M3969 | Eaton | FUSE 125A 1000V | Dotaz |
|
170M3954 | Eaton | FUSE 100A | Dotaz |
|
170M3960 | Eaton | FUSE 350A | Dotaz |
|
170M3975 | Eaton | FUSE 400A 1000V | Dotaz |
|
170M3972 | Eaton | FUSE 250A 1000V | Dotaz |
|
170M3956 | Eaton | FUSE 160A | Dotaz |
|
170M3906 | Eaton | FUSE 315A | Dotaz |
|
170M3974 | Eaton | FUSE 350A 1000V | Dotaz |
|
170M3903 | Eaton | FUSE 160A | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers