Koupit 170E9612 s BYCHPS
Koupit se zárukou
170E9612
- Part Number:
- 170E9612
- Výrobce:
- Bussmann (Eaton)
- Popis:
- FUSE 800A 1400V 3STN/210 AR
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 14069 Pieces
- Datový list:
- 170E9612.pdf
Úvod
BYCHIPS je distribuční odrůda pro 170E9612, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 170E9612 e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Velikost / Rozměry: | - |
|---|---|
| Série: | * |
| Obal: | Bulk |
| Paket / krabice: | - |
| Typ montáže: | - |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 8 Weeks |
| Výrobní číslo výrobce: | 170E9612 |
| Popis: | FUSE 800A 1400V 3STN/210 AR |
| Email: | [email protected] |
Související díly pro 170E9612
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
170E9713 | Eaton | FUSE 375A 3000V 3S/200 AR | Dotaz |
 |
C10G0.5 | Eaton | FUSE CARTRIDGE 500MA 500VAC 5AG | Dotaz |
|
170E9633 | Eaton | FUSE 800A 1400V 3SBKN/120AR | Dotaz |
 |
FLNR250.X | Littelfuse Inc. | FUSE CRTRDGE 250A 250VAC/125VDC | Dotaz |
|
170E9568 | Eaton | FUSE 630A 3000V 3TN/260 AR | Dotaz |
|
170E9685 | Eaton | FUSE 500A 750V 3EK/170 GR DC | Dotaz |
|
170E9180 | Eaton | FUSE 700A 1400V 3/140 AR | Dotaz |
 |
KLU-1600 | Eaton | FUSE CARTRIDGE 1.6KA 600VAC CYL | Dotaz |
|
170E9498 | Eaton | FUSE 500A 7000V 3BT/450 AR | Dotaz |
|
170E9187 | Eaton | FUSE 630A 1400V 3STN/140 AR | Dotaz |
|
170E9681 | Eaton | FUSE 500A 750V 3BKN/130 GR DC | Dotaz |
 |
TPS-15L | Eaton | FUSE CRTRDGE 15A 170VDC CYLINDR | Dotaz |
|
170E9252 | Eaton | FUSE 500A 1400V 3BKN/80 AR | Dotaz |
|
LSRK040.TXID | Littelfuse Inc. | FUSE CARTRIDGE 40A 600VAC/300VDC | Dotaz |
|
170E9712 | Eaton | FUSE 250A 3000V 3S/200 AR | Dotaz |
 |
2030.0255 | Schurter Inc. | FUSE BRD MNT 2.5A 125VAC/VDC RAD | Dotaz |
 |
0090.1030 | Schurter Inc. | FUSE CARTRIDGE 30A 1KVDC 5AG | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers