Koupit 106DCR2R3SGU s BYCHPS
Koupit se zárukou
106DCR2R3SGU
- Part Number:
- 106DCR2R3SGU
- Výrobce:
- Illinois Capacitor
- Popis:
- CAP 10F -20%, +50% 2.3V T/H
- Stav volného vedení / RoHS:
- Bez olova / V souladu RoHS
- dostupné množství:
- 13062 Pieces
- Datový list:
- 106DCR2R3SGU.pdf
Úvod
BYCHIPS je distribuční odrůda pro 106DCR2R3SGU, máme zásoby pro okamžitou přepravu a také k dispozici pro dlouhodobé zásobování. Zašlete nám svůj plán nákupu 106DCR2R3SGU e-mailem vám poskytneme nejlepší cenu podle svého plánu.
Specifikace
| Napětí - Jmenovitá: | 2.3V |
|---|---|
| Tolerance: | -20%, +50% |
| Ukončení: | PC Pins |
| Velikost / Rozměry: | 0.394" Dia (10.00mm) |
| Série: | DCR |
| Obal: | Bulk |
| Paket / krabice: | Radial, Can |
| Provozní teplota: | -25°C ~ 70°C |
| Typ montáže: | Through Hole |
| Úroveň citlivosti na vlhkost (MSL): | 1 (Unlimited) |
| Výrobní standardní doba výroby: | 15 Weeks |
| Výrobní číslo výrobce: | 106DCR2R3SGU |
| Životnost @ Temp.: | 1000 Hrs @ 70°C |
| Rozestup vývodù: | 0.197" (5.00mm) |
| Výška - Sedící (Max): | 0.866" (22.00mm) |
| Rozšířený popis: | 10F -20%, +50%(EDLC) Supercapacitor 2.3V Radial, Can 220 mOhm @ 1kHz 1000 Hrs @ 70°C |
| ESR (Equivalent Resistance Series): | 220 mOhm @ 1kHz |
| Popis: | CAP 10F -20%, +50% 2.3V T/H |
| kapacitní: | 10F |
| Email: | [email protected] |
Související díly pro 106DCR2R3SGU
| Obraz | Part Number | Výrobci | Popis | Pohled |
|---|---|---|---|---|
 |
XH414H-II06E | Seiko Instruments | CAP 70MF 3.3V SURFACE MOUNT | Dotaz |
 |
PAS311SR-VA6R | Taiyo Yuden | CAP 30MF 2.6V SURFACE MOUNT | Dotaz |
 |
CDLC351E2R7T11 | Cornell Dubilier Electronics (CDE) | CAP 350F 0% +20% 2.7V T/H | Dotaz |
 |
407DCR2R3SDG | Illinois Capacitor | CAPACITOR 400F 2.3V SNAP IN | Dotaz |
 |
PB-5R0V474-R | Eaton | CAP 470MF -20% +80% 5V T/H | Dotaz |
 |
BCAP0350 E270 T13 | Maxwell Technologies Inc. | CAP 350F 2.7V THROUGH HOLE | Dotaz |
 |
MAL219690102E3 | Vishay BC Components | CAP 90F -20% +80% 5.6V T/H | Dotaz |
 |
SCCS20B505SRB | AVX Corporation | CAPACITOR 5F 2.7V THRU HOLE | Dotaz |
Latest News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers